Dong-Ik Shin
at SAMSUNG Electro-Mechanics Co Ltd
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 6 February 2006 Paper
Dong-Ik Shin, Sung-Kwa Kim, Ho-Seop Jeong, SeokCheon Lee, YoungSu Jin, JungEun Noh, HyeRan Oh, KiUn Lee, Dong Ho Shin, Seok Ho Song
Proceedings Volume 6068, 60680Q (2006) https://doi.org/10.1117/12.643461
KEYWORDS: Cameras, Semiconducting wafers, Ultraviolet radiation, Polymers, Metals, Lens design, Aspheric lenses, Packaging, Glasses, Wafer bonding

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