We report the gate leakage current and threshold voltage characteristics of Al0.3Ga0.7N/GaN heterojunction field effect transistor (HFET) with metal-organic chemical vapor deposition (MOCVD) grown β-Ga2O3 as a gate dielectric for the first time. In this study, GaN channel HFET and β-Ga2O3 passivated metal-oxide-semiconductor-HFET (MOS-HFET) structures were grown in MOCVD using N2 as carrier gas on a sapphire substrate. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used to characterize the structural properties and surface morphology of the heterostructure. The electrical properties were analyzed using van der Pauw, Hall, and the mercury probe capacitance-voltage (C-V) measurement systems. The 2-dimensional electron gas (2DEG) carrier density for the heterostructure was found to be in the order of ~1013 cm-2. The threshold voltage shifted more towards the negative side for the MOSHFET. The high-low (Hi-Lo) frequency-based C-V method was used to calculate the interface charge density for the oxide-AlGaN interface and was found to be in the order of ~1012 cm2eV-1. A remarkable reduction in leakage current from 2.33×10-2 A/cm2 for HFET to 1.03×10-8 A/cm2 for MOSHFET was observed demonstrating the viability of MOCVD-grown Ga2O3 as a gate dielectric.
Ni/Y2O3/4H-SiC metal-oxide-semiconductor (MOS) structure has been realized on 20 μm thick 4H-SiC epitaxial layers by depositing 40 nm thick Y2O3 layers through pulsed laser deposition and using nickel as the gate contact. 4H-SiC based MOS structures with thin oxide layers are being considered as novel detector structures for ionizing radiation. Y2O3 being a wide bandgap (5.5 eV) and high-𝑘 dielectric (𝑘 = 14-16) is beneficial to lower the junction leakage current and increasing the bias voltage limit. The current-voltage (I-V) characteristics recorded for the fabricated MOS devices revealed excellent rectification properties and a very low leakage current density of 80 pA/cm2 at a gate bias of -500 V. The Mott-Schottky plot obtained from high frequency (1 MHz) capacitance-voltage (C-V) measurement revealed a linear trend as observed in Ni/4H-SiC Schottky barrier detectors. A built-in potential of ≈2.0 V has been calculated from the C-V characteristics. The radiation detection properties of the MOS detectors have been assessed through pulse height spectroscopy using a 241Am alpha particle source. The detectors revealed a well-defined peak in the pulse height spectrum with an energy resolution of 1.6% and a charge collection efficiency (CCE) of 82% at 0 V applied bias (self-biased mode) for the 5486 keV alpha particles. The energy resolution and the charge collection efficiency were seen to improve further with increased gate bias. A CCE of 1.0 and an energy resolution of 0.4% has been observed when the MOS detector was biased at -50 V. A very long hole diffusion length of 56 μm has been calculated using a drift-diffusion model and the variation of experimentally obtained CCE with bias voltage. Such long hole diffusion length and the high built-in potential has led to the highefficiency detection performance in self-biased mode. Capacitance-mode deep level transient spectroscopy revealed the presence of deep level trap centers commonly observed in 4H-SiC epilayers with trap concentrations similar to that has been observed in our previous devices.
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