Mr. Eric M. Panning Profile

Eric M. Panning

Vice President, Product Engineering

SPIE Involvement:

Conference Program Committee | Editor | Author

SPIE Journal Paper | 8 March 2022 Open Access

Special Section Guest Editorial: Novel Patterning Technologies II

Douglas Resnick, Eric Panning

JM3, Vol. 21, Issue 01, 011001, (March 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.1.011001

KEYWORDS: Optical lithography, Nanoimprint lithography, Lithography, Nanotechnology, Wet etching, Semiconducting wafers, Silicon, Silica, Semiconductors, Satellites

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SPIE Journal Paper | 1 October 2018 Open Access

Special Section Guest Editorial: Novel Patterning Technologies

Eric Panning, Martha Sanchez

JM3, Vol. 17, Issue 03, 031201, (October 2018) https://doi.org/10.1117/12.10.1117/1.JMM.17.3.031201

KEYWORDS: Optical lithography, 3D displays, 3D acquisition, Directed self assembly, Nanoimprint lithography, Microopto electromechanical systems, Packaging, Semiconductors, Nanostructures, Light emitting diodes

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Proceedings Article | 11 November 2015 Paper

EUV mask infrastructure readiness and gaps for TD and HVM

Ted Liang, John Magana, Kishore Chakravorty, Eric Panning, Guojing Zhang

Proceedings Volume 9635, 963509 (2015) https://doi.org/10.1117/12.2202724

KEYWORDS: Photomasks, Inspection, Extreme ultraviolet, Pellicles, Extreme ultraviolet lithography, Particles, Scanners, Semiconducting wafers, Deep ultraviolet, Defect inspection

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Proceedings Article | 15 March 2007 Paper

Low-cost EUV collector development: design, process, and fabrication

Ranju Venables, Michael Goldstein, Darell Engelhaupt, Sang Lee, Eric Panning

Proceedings Volume 6517, 65171T (2007) https://doi.org/10.1117/12.713120

KEYWORDS: Optical design, Surface finishing, Polishing, Glasses, Extreme ultraviolet, Nickel, Ruthenium, Extreme ultraviolet lithography, Reflectivity, Coating

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Cost of ownership (COO) is an area of concern that may limit the adoption and usage of Extreme Ultraviolet Lithography (EUVL). One of the key optical components that contribute to the COO budget is the collector. The collectors being fabricated today are based on existing x-ray optic design and fabrication processes. The main contributors to collector COO are fabrication cost and lifetime. We present experimental data and optical modeling to demonstrate a roadmap for optimized efficiency and a possible approach for significant reduction in collector COO. Current state of the art collectors are based on a Wolter type-1 design and have been adapted from x-ray telescopes. It uses a long format that is suitable for imaging distant light sources such as stars. As applied to industrial equipment and very bright nearby sources, however, a Wolter collector tends to be expensive and requires significant debris shielding and integrated cooling solutions due to the source proximity and length of the collector shells. Three collector concepts are discussed in this work. The elliptical collector that has been used as a test bed to demonstrate alternative cost effective fabrication method has been optimized for collection efficiency. However, this fabrication method can be applied to other optical designs as well. The number of shells and their design may be modified to increase the collection efficiency and to accommodate different EUV sources The fabrication process used in this work starts with a glass mandrel, which is elliptical on the inside. A seed layer is coated on the inside of the glass mandrel, which is then followed by electroplating nickel. The inside/exposed surface of the electroformed nickel is then polished to meet the figure and finish requirements for the particular shell and finally coated with Ru or a multilayer film depending on the angle of incidence of EUV light. Finally the collector shell is released from the inside surface of the mandrel. There are several potential cost and fabrication advantages to this process. There is flexibility in the choice of material for producing the mandrel - this allows for optimizing the cost of fabrication of the mandrel. Moreover, since the final surface and figure of the collector optic can be modified, after electroforming the optic, the mandrel, in principle does not have a limited lifetime. Finally, the mandrel provides mechanical support to the electroformed optic throughout the fabrication process, thereby reducing deformation of the optic during polishing and coating. The optical design, optimization of collection efficiency, fabrication and characterization results is discussed in this work.

Proceedings Article | 6 May 2005 Paper

One small step: world's first integrated EUVL process line

Jeanette Roberts, Terence Bacuita, Robert Bristol, Heidi Cao, Manish Chandhok, Sang Lee, Eric Panning, Melissa Shell, Guojing Zhang, Bryan Rice

Proceedings Volume 5751, (2005) https://doi.org/10.1117/12.600259

KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Photomasks, Semiconducting wafers, Reflectivity, Reticles, Mirrors, Light sources, Plasma, Mask making

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Proceedings Article | 20 May 2004 Paper

Comparison of techniques to measure the point spread function due to scatter and flare in EUV lithography systems

Manish Chandhok, Sang Lee, Christof Krautschik, Guojing Zhang, Bryan Rice, Michael Goldstein, Eric Panning, Robert Bristol, Alan Stivers, Melissa Shell

Proceedings Volume 5374, (2004) https://doi.org/10.1117/12.535995

KEYWORDS: Point spread functions, Modulation transfer functions, Mirrors, Extreme ultraviolet lithography, Critical dimension metrology, Spatial frequencies, Extreme ultraviolet, Optical proximity correction, Fourier transforms, Deep ultraviolet

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Proceedings Article | 20 May 2004 Paper

Determination of the flare specification and methods to meet the CD control requirements for the 32-nm node using EUVL

Manish Chandhok, Sang Lee, Christof Krautschik, Bryan Rice, Eric Panning, Michael Goldstein, Melissa Shell

Proceedings Volume 5374, (2004) https://doi.org/10.1117/12.536024

KEYWORDS: Critical dimension metrology, Mirrors, Point spread functions, Nanoimprint lithography, Cadmium, Extreme ultraviolet, Photomasks, Extreme ultraviolet lithography, Polishing, Spatial frequencies

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Proceedings Article | 16 June 2003 Paper

Implementing flare compensation for EUV masks through localized mask CD resizing

Christof Krautschik, Manish Chandhok, Guojing Zhang, Sang Hun Lee, Michael Goldstein, Eric Panning, Bryan Rice, Robert Bristol, Vivek Singh

Proceedings Volume 5037, (2003) https://doi.org/10.1117/12.482344

KEYWORDS: Photomasks, Critical dimension metrology, Point spread functions, Chromium, Cadmium, Optical proximity correction, Extreme ultraviolet, Extreme ultraviolet lithography, Convolution, Mirrors

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Proceedings Article | 16 June 2003 Paper

Lithographic characterization of improved projection optics in the EUVL engineering test stand

Donna O'Connell, Sang Hun Lee, William Ballard, Daniel Tichenor, Louis Bernardez, Steven Haney, Terry Johnson, Pamela Barr, Alvin Leung, Karen Jefferson, William Replogle, John Goldsmith, Henry Chapman, Patrick Naulleau, Stefan Wurm, Eric Panning

Proceedings Volume 5037, (2003) https://doi.org/10.1117/12.484967

KEYWORDS: Projection systems, Lithography, Monochromatic aberrations, Extreme ultraviolet lithography, Extreme ultraviolet, Semiconducting wafers, Scanning electron microscopy, Line edge roughness, Reticles, Wavefronts

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Proceedings Article | 12 June 2003 Paper

Intel's EUV resist development

Heidi Cao, Jeanette Roberts, Janel Dalin, Manish Chandhok, Robert Meagley, Eric Panning, Melissa Shell, Bryan Rice

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485095

KEYWORDS: Extreme ultraviolet, Line width roughness, Absorbance, Photoresist materials, Extreme ultraviolet lithography, Photoresist developing, Optical lithography, Lithography, Polymers, Line edge roughness

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Proceedings Article | 1 July 2002 Paper

Lithographic evaluation of the EUV engineering test stand

Sang Hun Lee, Daniel Tichenor, William Ballard, Luis Bernardez, John Goldsmith, Steven Haney, Karen Jefferson, Terry Johnson, Alvin Leung, Donna O'Connell, William Replogle, John Wronosky, Kenneth Blaedel, Patrick Naulleau, Kenneth Goldberg, Eric Gullikson, Henry Chapman, Stefan Wurm, Eric Panning, Pei-yang Yan, Guojing Zhang, John Bjorkholm, Glenn Kubiak, Donald Sweeney, David Attwood, Charles Gwyn

Proceedings Volume 4688, (2002) https://doi.org/10.1117/12.472300

KEYWORDS: Extreme ultraviolet, Lithography, Projection systems, Semiconducting wafers, Extreme ultraviolet lithography, Photomasks, Reticles, Printing, Point spread functions, Image resolution

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Proceedings Article | 20 December 2001 Paper

Initial results from the EUV engineering test stand

Daniel Tichenor, Avijit Ray-Chaudhuri, Sang Hun Lee, Henry Chapman, William Replogle, Kurt Berger, Richard Stulen, Glenn Kubiak, Leonard Klebanoff, John Wronosky, Donna O'Connell, Alvin Leung, Karen Jefferson, William Ballard, Layton Hale, Kenneth Blaedel, John Taylor, James Folta, Eberhard Spiller, Regina Soufli, Gary Sommargren, Donald Sweeney, Patrick Naulleau, Kenneth Goldberg, Eric Gullikson, Jeffrey Bokor, David Attwood, Uwe Mickan, Ralph Hanzen, Eric Panning, Pei-yang Yan, John Bjorkholm, Charles Gwyn

Proceedings Volume 4506, (2001) https://doi.org/10.1117/12.450953

KEYWORDS: Extreme ultraviolet, Reticles, Projection systems, Semiconducting wafers, Lithography, Monochromatic aberrations, Extreme ultraviolet lithography, Plasma, Sensors, Mirrors

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Proceedings Article | 19 July 2000 Paper

Current status of 157-nm mask technology development

Giang Dao, Ronald Kuse, Kevin Orvek, Eric Panning, Roswitha Remling, Jun-Fei Zheng, Munehiko Tsubosaki, Fu-Chang Lo

Proceedings Volume 4066, (2000) https://doi.org/10.1117/12.392091

KEYWORDS: Photomasks, Reticles, Pellicles, Silica, Lithography, Contamination, Chromium, Manufacturing, Semiconducting wafers, Transmittance

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Proceedings Article | 5 July 2000 Paper

Progress in 157-nm lithography development at Intel: resists and reticles

Veena Rao, Eric Panning, Ling Liao, John Hutchinson, Andrew Grenville, Susan Holl, Don Bruner, Raghu Balasubramanian, Ronald Kuse, Giang Dao, Jun-Fei Zheng, Kevin Orvek, Joseph Langston, Fu-Chang Lo

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.389005

KEYWORDS: Photomasks, Lithography, Photoresist developing, Reticles, Silica, Optical lithography, Photoresist materials, Chromium, Phase shifts, Absorbance

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Showing 5 of 14 publications

SPIE Conference Volume | 30 November 2023

International Conference on Extreme Ultraviolet Lithography 2023

SPIE Conference Volume | 5 July 2022

Novel Patterning Technologies 2022

SPIE Conference Volume | 19 April 2021

Novel Patterning Technologies 2021

SPIE Conference Volume | 21 April 2020

Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020

SPIE Conference Volume | 17 June 2019

Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019

Showing 5 of 10 publications

Conference Committee Involvement (26)

Novel Patterning Technologies 2025

24 February 2025 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography 2024

30 September 2024 | Monterey, California, United States

Novel Patterning Technologies 2024

26 February 2024 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography 2023

2 October 2023 | Monterey, California, United States

Novel Patterning Technologies 2023

27 February 2023 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography 2022

26 September 2022 | Monterey, California, United States

Novel Patterning Technologies 2022

25 April 2022 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography 2021

27 September 2021 | Online Only, United States

Novel Patterning Technologies 2021

22 February 2021 | Online Only, California, United States

Extreme Ultraviolet (EUV) Lithography XII

22 February 2021 | Online Only, California, United States

International Conference on Extreme Ultraviolet Lithography 2020

21 September 2020 | Online Only, California, United States

Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020

24 February 2020 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography XI

24 February 2020 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography 2019

16 September 2019 | Monterey, California, United States

Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2019

25 February 2019 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography X

25 February 2019 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography 2018

17 September 2018 | Monterey, California, United States

Extreme Ultraviolet (EUV) Lithography IX

26 February 2018 | San Jose, California, United States

Novel Patterning Technologies 2018

26 February 2018 | San Jose, California, United States

International Conference on Extreme Ultraviolet Lithography

11 September 2017 | Monterey, California, United States

Extreme Ultraviolet (EUV) Lithography VIII

27 February 2017 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography VII

22 February 2016 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography VI

23 February 2015 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography V

24 February 2014 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography IV

25 February 2013 | San Jose, California, United States

Extreme Ultraviolet (EUV) Lithography III

13 February 2012 | San Jose, California, United States

Showing 5 of 26 Conference Committees

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