KEYWORDS: Metrology, Bridges, Manufacturing, Data modeling, Time metrology, Semiconducting wafers, Reticles, Internet, Design for manufacturability, Data integration
In the world of today’s internet of things economy, the number of semiconductor designs is increasing rapidly. A cost effective way is needed to set up new designs for manufacturing. All available data sources need to be utilized to do the setup. In this paper we suggest two new approaches for reusing historical data for future designs: Combining historical fab-generated data with full reticle design features to predict optimal process conditions, and the concept of cross metrology integration of fab-generated data across multiple metrology steps to improve data quality.
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