Dr. George A. Antonelli
Vice President of R&D
SPIE Involvement:
Author
Publications (13)

SPIE Journal Paper | 6 November 2024 Open Access
Ezra Pasikatan, George Antonelli, Nick Keller, Subhadeep Kal, Matthew Rednor, Kandabara Tapily, Dave Hetzer, Mark Schaefer, Markus Kuhn, Satoshi Murakami, Alain Diebold
JM3, Vol. 23, Issue 04, 044004, (November 2024) https://doi.org/10.1117/12.10.1117/1.JMM.23.4.044004
KEYWORDS: Silicon, Superlattices, Germanium, Etching, Film thickness, Nondestructive evaluation, Silicon nitride, Scanning transmission electron microscopy, Scatterometry, Data modeling

Proceedings Article | 10 April 2024 Presentation
Proceedings Volume 12955, 129550Z (2024) https://doi.org/10.1117/12.3010409
KEYWORDS: Diffraction gratings, X-rays, Semiconducting wafers, X-ray diffraction, Metrology, Fabrication, Etching, Spectrometers, Spectral resolution, Reflection

Proceedings Article | 10 April 2024 Presentation + Paper
Nick Keller, Marc Poulingue, Ross Grynko, Troy Ribaudo, G. Andrew Antonelli, Victor Li, Marcello Ravasio, Delphine Le Cunff
Proceedings Volume 12955, 1295514 (2024) https://doi.org/10.1117/12.3010926
KEYWORDS: Simulations, Semiconducting wafers, Metrology, Nondestructive evaluation, Etching, Process control, Scatterometry

Proceedings Article | 10 April 2024 Presentation + Paper
Ezra Pasikatan, G. Andrew Antonelli, Nicholas Keller, Subhadeep Kal, Matthew Rednor, Markus Kuhn, Satoshi Murakami, Alain Diebold
Proceedings Volume 12955, 129550K (2024) https://doi.org/10.1117/12.3010523
KEYWORDS: Etching, Silicon, Superlattices, Scatterometry, Film thickness, Germanium, Scanning transmission electron microscopy, Mueller matrices, X-ray diffraction, Metrology

Proceedings Article | 27 April 2023 Presentation + Paper
Nick Keller, Zhuo Chen, Peter Wang, Rostislav Grynko, Troy Ribaudo, G. Andrew Antonelli, Youcheng Wang, Joshua Frederick, Sadao Takabayashi, John Hauck, Dan Engelhard
Proceedings Volume 12496, 124961Z (2023) https://doi.org/10.1117/12.2657719
KEYWORDS: Simulations, Metals, Finite-difference time-domain method, 3D acquisition, 3D metrology, Semiconducting wafers, Etching, Electric fields, Dielectrics, Plasmonics

Showing 5 of 13 publications
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