Dr. Hongtao Han Profile

Dr. Hongtao Han

at Shenzhen O-Film Technologies Co Ltd

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 3 December 2009 Paper

Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors

Hongtao Han, Keith Main

Proceedings Volume 7631, 76311P (2009) https://doi.org/10.1117/12.852776

KEYWORDS: Semiconducting wafers, Wafer-level optics, Cameras, Optics manufacturing, Image sensors, Wafer bonding, Integrated optics, Packaging, Cell phones, Glasses

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Proceedings Article | 30 April 1999 Paper

Micro integration of VCSELs, detectors, and optics

John Hammond, Eric Johnson, Hongtao Han, Adam Fedor

Proceedings Volume 3631, (1999) https://doi.org/10.1117/12.348316

KEYWORDS: Silicon, Semiconducting wafers, Sensors, Packaging, Optical alignment, Wafer-level optics, Optical components, Vertical cavity surface emitting lasers, Active optics, Optics manufacturing

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Proceedings Article | 30 April 1999 Paper

Integration of silicon bench micro-optics

Hongtao Han, Jared Stack, Jay Mathews, Charles Koehler, Eric Johnson, Alan Kathman

Proceedings Volume 3631, (1999) https://doi.org/10.1117/12.348318

KEYWORDS: Silicon, Optical fibers, Optical arrays, Micro optics, Integrated optics, Optics manufacturing, Fiber optics, Diffractive optical elements, Optical alignment, Etching

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Proceedings Article | 20 September 1996 Paper

Low-cost single-mode refractive plate switch using micromachined silicon waferboard for passive alignment

Hongtao Han, Bernie Caron, Warren Lewis, Jay Mathews, Robert Boudreau, Terry Bowen, Dale Murray

Proceedings Volume 2893, (1996) https://doi.org/10.1117/12.252076

KEYWORDS: Silicon, Etching, Switches, Optical fibers, Optical alignment, Optical switching, Anisotropic etching, Optoelectronics, Optical arrays, Crystals

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Proceedings Article | 29 March 1996 Paper

Micromachined silicon structures for single-mode passive alignment

Hongtao Han, J. Schramm, Jay Mathews, Robert Boudreau

Proceedings Volume 2691, (1996) https://doi.org/10.1117/12.236913

KEYWORDS: Silicon, Optical alignment, Etching, Reactive ion etching, Semiconducting wafers, Manufacturing, Photomicroscopy, Fiber to the x, Optoelectronic packaging, Tolerancing

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Conference Committee Involvement (1)

Photonics Packaging and Integration II

26 January 2000 | San Jose, CA, United States

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