Key features of the RIM-13 EUV actinic reticle imaging microscope are summarised. This is a tool which generates aerial images from blank or patterned EUV masks, emulating the illumination and projection optics of an exposure tool. Such images of mask defects, acquired by a CCD camera, are analysed using the tool software to predict their effect on resist exposure. Optical, mechanical and software performance of the tool are reported.
Key features are presented of the RIM-13 reticle imaging microscope developed for actinic aerial image monitoring of blank and patterned EUV reticles. Details of the opto-mechanical design, module layout, major subsystems including the EUV source and performance of the tool are presented.
Key features are presented of two high-resolution EUV imaging tools: the MS-13 Microstepper wafer exposure and the RIM-13 reticle imaging microscope. The MS-13 has been developed for EUV resist testing and technology evaluation at the 32nm node and beyond, while the RIM-13 is designed for actinic aerial image monitoring of blank and patterned EUV reticles. Details of the design architecture, module layout, major subsystems and performance are presented for both tools.
Pulsed laser sources are widely used for the micro-processing of materials from the structuring and patterning of surfaces to the direct machining of devices. This paper discusses laser micro-processing techniques for the fabrication of microstructures with high accuracy and precision. Techniques discussed include laser mask projection techniques and direct beam micromachining using galvo-scanners and high precision motion stages, with a variety of different lasers. Examples of the application of these techniques to the manufacture of MEMS and MOEMS devices are discussed.
The laser micromachining characteristics of indium phosphide, lithium niobate and silicon have been characterised using a 355nm neodymium vanadate laser and 193nm and 248nm excimer lasers. Etch rates for these materials are presented at the different laser wavelengths. High quality cutting of the three materials is demonstrated with the 355nm laser and an excimer laser mask projection method is subsequently used to micromachine precision V-grooves as fibre placement structures. Silicon microbenches, used for the integration of multiple-function devices, are also produced using the 355nm laser.
Vacuum UV laser micromachining is used to produce microstructures in common photonics materials. The ablation etch rates of lithium niobate, fused silica and indium phosphide are measured at 157nm and angled facets and v-grooves are machined into the materials using a high NA mask projection system. The applicability of such micromachined structures for photonics devices is discussed and future developments outlined.
The area of display devices has experienced extremely rapid growth in recent years and these advances show no sign of declining. One of the major developments in this field has been the use of lasers for various microfabrication tasks. This paper describes some techniques which have been developed using excimer lasers for the production of novel microstructures in polymer materials. Examples of the types of microstructures which are produced are presented and their applicability for display device applications is outlined. Forthcoming developments in the laser manufacture of displays are discussed.
As laser micromachining has developed in recent years, there has emerged a need for the simplification of the process to produce MEMS structures where the stages of manufacture do not require an in-depth knowledge of laser micromachining techniques. This paper describes the initial stages of such an approach - the laser micromachining 'toolbox' - which enable the optimum machining choices to be made from various design requirements. Some of the elements of the toolbox are introduced and quantified in the particular case of excimer laser micromachining. These features are then used to produce a 3D microstructure to demonstrate the capabilities of this approach. Future developments in this area are discussed.
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