We developed a novel 512 x 320 tip-tilt micro mirror array (MMA) together with the entire related technology platform, including mirror fabrication process, integrated CMOS address circuitry and external drive electronics. The MMA itself consists of 2axis-tip-tilt actuators at 48μm pixel size, allowing a continuous pure tip-tilt motion up to 3.5° in arbitrary directions, fully calibratable at standard deviations of better than 0.025°. The mirrors are realized within a 2-level architecture defined by three structural layers, two for hinge and reinforcement suspension and one for the overlying mirror. They are fabricated by surface-micromachining within a fully CMOS compatible process. MMA programming is accomplished by an underlying CMOS backplane supporting drive voltages up to 27V and frame rates up to 3.6kHz.
Fraunhofer IPMS has developed a one-dimensional high-speed spatial light modulator in cooperation with Micronic
Mydata AB. This SLM is the core element of the Swedish company’s new LDI 5sp series of Laser-Direct-Imaging
systems optimized for processing of advanced substrates for semiconductor packaging. This paper reports on design,
technology, characterization and application results of the new SLM. With a resolution of 8192 pixels that can be
modulated in the MHz range and the capability to generate intensity gray-levels instantly without time multiplexing, the
SLM is applicable also in many other fields, wherever modulation of ultraviolet light needs to be combined with high
throughput and high precision.
Facing the recent developments in the area of (quasi) continuous wave lasers towards higher power the Fraunhofer IPMS
introduces a novel light modulator incorporating an innovative architecture optimized for high laser power applications
requiring a fast device. As a novelty each pixel is composed of a number of micro mirrors, aligned in a row. That
approach allows for, in principle, very long pixels with uniform surface properties. This concept in turn results in
reduction of power density at the light modulator surface and hence opens the way to high power applications allowing
power densities in the range of several ten W/cm2 at the light modulator surface. Each pixel can be switched to black,
white or even arbitrary gray values with very high speed. This paper summarizes the device design, working concept,
mechanical properties for both static and dynamic operation, and surface properties. Application relevant subjects as
stability under intense laser illumination complete the discussion.
The present article discusses an optical concept for the characterization of diffractive micromirror arrays (MMAs) within
an extended wavelength range from the deep ultra-violet up to near-infrared. The task derives from the development of a
novel class of MMAs that will support programmable diffractive properties between 240 nm and 800 nm. The article
illustrates aspects of the achromatic system design that comprises the reflective beam homogenization with divergence
control and coherence management for an appropriate MMA illumination as well as the transfer of phase modulating
MMA patterns into intensity profiles for contrast imaging. Contrast measurements and grey scale imaging demonstrate
the operation of the characterization system and reflect the encouraging start of technology development for
multispectral, diffractive MMAs.
KEYWORDS: Mirrors, Actuators, Electronics, Metals, Micromirrors, Deep ultraviolet, Control systems, Near infrared, Reflectivity, Electron beam lithography
A new generation of micromirror arrays (MMAs) with torsional actuators is being developed within the European
research project MEMI in order to extend the usable spectral range of diffractive MMAs from deep ultraviolet into the
visible and near infrared. The MMAs have 256 x 256 pixels reaching deflections above 350 nm at a frame rate of 1 kHz,
which enables an operation in the target wavelength range between 240 nm and 800 nm. Customized driver electronics
facilitates computer controlled operation and simple integration of the MMA into various optical setups. Tests in the
visible wavelength range demonstrate the functionality and the high application potential of first MMA test samples.
Aluminum nitride (AlN) is a promising piezoelectric material suitable for full CMOS compatible MEMS processes. Due
to the transversal inverse piezoelectric effect the use of AlN enables quasistatic deformable mirrors by actively coupling
lateral strain in micro machined membranes. In this work a fast and reliable way for reactive magnetron rf-sputtered aluminum
nitride thin films with piezoelectric properties is shown. The thin AlN films were deposited on amorphous TiAl,
SiO2 and silicon substrates using an industrial PVD cluster system. The morphologies of the deposited polycrystalline
AlN films are characterized by X-ray diffraction measurements and SEM images of the layer surfaces. An enhanced
texture coefficient is used to demonstrate the correlation between the X-ray diffraction pattern and the surface topology.
High values of this enhanced texture coefficient will guarantee piezoelectric properties. Virtual powder X-ray diffraction
experiments are used to determine the relative powder intensities required for texture coefficient evaluation. The transversal
inverse piezoelectric coupling coefficient d31 is measured for tempered and untreated aluminum nitride thin films
with high enhanced texture coefficients by quasistatic deflected wafer cantilevers.
The Fraunhofer IPMS, in cooperation with Micronic Laser Systems, develops and fabricates micromirror arrays used as
spatial light modulators (SLM) for image generation in microlithography. The SLMs used consist of 2048×512
individually addressable micromirrors of 16×16μm2 and can be operated in an analog mode at a frame rate of up to
2 kHz. There are continued efforts to improve the performance of the mask writers with respect to stability and CD
uniformity, which include measures to improve the SLMs used, especially with respect to the optical quality and the
stability.
Therefore, a new technology has been introduced which allows to use different materials for the mechanical suspension
and the mirror, thus optimizing them separately. The hinges are made of a thin layer of a material with very good creep
resistance, while the mirrors consist of a thick aluminium alloy with high reflectivity in DUV. Furthermore, the same
inorganic material is used for the planarization of the electrodes (by means of chemical mechanical polishing) and as
sacrificial layer for the actuator fabrication. Thus, at the end of the process, all sacrificial material, including that
between the electrodes is removed. In this way, the charging effects caused by dielectrics between the electrodes (as seen
in the previous devices) are eliminated.
The first devices using the technology described above have been fabricated and tested. The first tests in a lithography
machine show that considerable improvements in machine performance can be expected. The next steps are to stabilize
and optimize the process.
At Fraunhofer IPMS Dresden micromechanical mirror arrays are developed and fabricated using a high-voltage CMOS
process for applications such as lithographic mask writers and adaptive optics. Different approaches for the fabrication of
micromechanical mirror arrays with up to 1 million analogue addressable pixels in a MEMS-on-CMOS technology are
discussed: sacrificial layer technologies of 1-level actuators made from a single Al-TiAl-Al structural multilayer or 2-level actuators with an additional TiAl hinge layer respectively. Also the fabrication of single crystalline Si micro-mirrors
using layer-transfer bonding is discussed.
Large micromechanical mirror arrays (MMA) with analog pixel deflection integrated onto active CMOS address circuitry require both high-quality planar reflective optical surfaces and a stable deflection versus voltage characteristic. However, for implementing a CMOS-compatible surface-micromachining process, certain obstacles such as a restricted thermal budget and a limited selection of suitable materials must be overcome. Amorphous TiAl is presented as a new actuator material for monolithical MEMS integration onto CMOS circuitry. TiAl films may be sputter deposited at room temperature, have an x-ray amorphous structure, and a low stress gradient. The glassy structure and high melting point make TiAl less vulnerable to stress relaxation, which makes TiAl an ideal spring material. One-level actuators with TiAl or Al-TiAl-Al structural layers and two-level actuators with separate TiAl spring and Al-alloy mirror layers were fabricated and tested with respect to their drift stability. The stability of TiAl-based actuators was found to be superior in comparison to one-level Al-alloy actuators. Two-level actuators with TiAl hinges emerge as the most promising design.
The large-scale integration of analog operable MEMS micro-mirrors onto active CMOS address circuitry requires high
quality planar reflective optical surfaces but also a stable deflection vs. voltage characteristic. However, for
implementing a CMOS compatible surface micromachining process, certain obstacles like a restricted thermal budget
and a limited selection of suitable materials must be overcome. In this paper, amorphous TiAl is presented as a new
actuator material for monolithical MEMS integration onto CMOS circuitry at room temperature. Sputter deposited TiAl
has an x-ray amorphous structure and a low stress gradient. The missing long range order and the high melting point help
to virtually eliminate stress relaxation effects, i.e. TiAl hinges behave almost perfectly elastic. In a first study, 40 &mgr;m
wide piston mirrors have been implemented onto substrates with fixed wired address electrode arrays. The actuators had
a 300 nm TiAl core sandwiched between two layers of 25 nm Al. The devices reach a maximum deflection of about 500
nm at a dc voltage of about 23V. The drift-stability of the deflection has been tested at "worst case" conditions close to
the deflection limit. During 30 min of continuous deflection near 500 nm a mechanical drift below 25nm has been
observed. TiAl offers the perspective for actuators capable of a stable analog operation, which is essential to many
applications, such as adaptive optics.
This paper addresses different highly reflective optical coatings on micro scanning mirrors (MSM) for applications in the NIR-VIS-UV- spectral region to enable new applications at high optical power density like laser marking and material treatment. In the common case of MSM with an unprotected Al coating, the absorption limits the maximal power density because of induced heating. In contrast to macroscopic optics HR-micro mirror coatings have to guarantee additional demands like low-stress and CMOS compatibility. Hence, to enable novel high power applications of MSM in the NIR-VIS-UV spectral region highly reflective low-stress coatings have been developed according to a triple strategy: (a) broadband metallic reflectors, (b) dielectric multilayers and (c) enhanced hybrid coatings.
For Au and Ag based NIR-coatings an excellent mirror planarity and a reflectance around 99 % (@ 1064 nm) have been achieved, whereas dielectric coatings reached 99.7 % for a (LH)4 design and thinner low-stress hybrid NIR-coatings reached up to 99.8 % enabling an improved mirror planarity and excellent laser damage threshold. For the VIS and UV spectral region enhanced hybrid HR-coatings have been favored, because they enable high reflectance of up to 99.7 % @ 633 nm or 98.8 % @ 308 nm in combination with low stress, high mirror planarity and CMOS compatibility.
KEYWORDS: Actuators, Electrodes, Mirrors, Capacitors, Analog electronics, Electronics, Finite element methods, Chemical elements, Safety, Electromagnetism
Electrostatic Micro-actuators are being increasingly used for a wide variety of applications such as spatial light modulators, scanning mirrors, optical cross connects, micro-valves, and others. Usually the electrical forces operate in one direction and are balanced by a mechanical spring. The resulting deflection is then either defined by a mechanical stop, or it is only a meta-stable equilibrium position: at an additional external force or deflection it will snap to a different position, frequently again defined by a mechanical stop. This issue is well known and is often called 'pull-in'. In the often used parallel-plate capacitor actuator, the instability already begins at a deflection of only on third of the original capacitor plate separation. For safety reasons and due to the steep response-curve one can only use an even smaller fraction of the mechanically possible movement. This means, that the gap below the actuator has to be designed very much larger than the required maximum deflection. To get the pre-described force and deflection, a much higher voltage is needed than for potential smaller gap widths. The useable range of deflection for many types of micro-actuators can be extended without the penalty of large drive voltage or low shock resistivity, by employing springs with steeper-than-linear restoring force. Alternatively, the voltage needed for a given range of deflection may be reduced. This paper shows the benefits and how to design and dimension these types of springs.
The present study of silica thin films illustrates a new way of direct writing diffractive phase elements by means of UV laser ablation. The concept consists in the conversion of highly absorbing silica layers, which are suitable for laser ablation, into UV transparent structures by thermal annealing, after a direct laser patterning process. This concept has been investigated in detail for several process parameters. As example, a pixel pattern, generated by an appropriate optical design algorithm, is transferred into a phase delay pattern in form of a silica surface relief, which results in a diffractive shaping of a beam transmitted (or reflected) by this structured layer. The direct mask patterning could be achieved at a moderate laser fluence of 350 mJ/cm2 with a 248 nm excimer laser.
This paper deals with vacuum UV optical coatings for micro mirrors applications. High reflecting low-stress optical coatings for the next-generation of micro mechanical mirrors have been developed. The optimized metal systems are applicable for the VUV spectral region and can be integrated in the technology of MOEMS, such as spatial light modulators (SLM) and micro scanning mirrors.
This paper addresses different highly reflective optical coatings on micro scanning mirrors (MSM) for applications in the NIR-VIS-UV-spectral region to enable new applications at high optical power density like laser marking and material treatment. In the common case of MSM with an unprotected Al coating, the absorption limits the maximal power density because of induced heating. In contrast to macroscopic optics HR-micro mirror coatings have to guarantee additional demands like low-stress and CMOS compatibility. Hence, to enable novel high power applications of MSM in the NIR-VIS-UV spectral region highly reflective low-stress coatings have been developed according to a triple strategy: (a) broadband metallic reflectors, (b) dielectric multilayers and (c) enhanced hybrid coatings. For Au and Ag based NIR-coatings an excellent mirror planarity and a reflectance around 99 % (@ 1064 nm) have been achieved, whereas dielectric coatings reached 99.7 % for a (LH)4 design and thinner low-stress hybrid NIR-coatings reached up to 99.8% enabling an improved mirror planarity and excellent laser damage threshold. For the VIS and UV spectral region enhanced hybrid HR-coatings have been favored, because they enable high reflectance of up to 99.7 % @ 633 nm or 98.8 % @ 308 nm in combination with low stress, high mirror planarity and CMOS compatibility.
High reflecting low-stress optical coatings for the next-generation of micro mechanical mirrors have been developed. The optimized metal systems are applicable from VUV and DUV down to the UV and VIS spectral region and can be integrated in the technology of MOEMS, such as spatial light modulators (SLM) and micro scanning mirrors. This optimized metal designs enable to reconcile high optical performances with adequate mechanical properties and convenient CMOS compatibility. Currently, micro-mirror arrays with enhanced highly reflective coatings for DUV (λ = 193 nm) and VUV (λ = 157 nm) exist as prototypes.
This paper addresses different highly reflective optical coatings on micro scanning mirrors (MSM) for applications in the NIR-spectral region to enable new applications like laser marking and material treatment at high optical power density. In the case of MSM with an unprotected Al coating, the absorption limits the maximal power density because of induced heating. The damage threshold for unprotected Al coatings was investigated. In addition highly reflective enhanced metallic and dielectric multilayer coatings for the NIR have been developed and characterized. These coatings resolve the problems of unprotected aluminum coatings related to NIR absorption and the resulting limitation of applicable laser power density. The coatings ensure a high reflectance even in corrosive environments. Enhanced metallic broadband reflectors reach a reflectivity of 98.7% at 1064 nm whereas narrow-band dielectric multilayer coatings reach a reflectivity of 99.7% at 1064 nm.
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