This study introduces Microsphere-Assisted Hyperspectral Imaging (MAHSI), the world’s first metrology system combining microsphere super-resolution and hyperspectral imaging. The system achieves an ultra-small measurement spot size of 14.4 nm and an optical resolution of 66 nm, overcoming the diffraction limit and enabling precise non-destructive measurements of complex 3D semiconductor structures. A high-speed novel autofocus method has been developed specifically for the ultra-close working distances required by microsphere super-resolution optics for the first time. This innovative technique only requires two spectra acquisition, as a result, it can achieve fast and precise approach of the objective lens, ensuring accurate measurements without damaging the sample. The system has successfully monitored the uniformity of cell blocks in DRAM, and demonstrates its feasibility for semiconductor metrology. As semiconductor processes become increasingly refined, the proposed MAHSI system can be innovative and effective solution for encountered metrology and inspection challenges in semiconductor device analysis.
We propose a novel spectrum measurement system named Microsphere-assisted nanospot spectroscopic reflectometry (MASR) by using the super-resolution image over the Rayleigh’s resolution limit in white-light. The proof of concept and optimal configuration of MASR are fully verified by utilizing both FDTD and ray optics simulations. At the same time, we experimentally validate the usefulness of MASR by obtaining the spectra from extremely small spot of 210 nm which is 119X smaller than 25 μm of conventional spectrum measurement system due to 530X super resolution enhanced magnification by optimally using microsphere that is definitely overcoming the physical limit of the optical resolution. It is important to note that the proposed technique has a capability to measure the spectrum from the extremely tight area, diameter of 210 nm, resulting in monitoring in-cell uniformity and structural changes in narrow and small area device patterns. Furthermore, our system can be combined with various optical measurement systems as a module which can upgrade optical resolution and magnification. To the best of our knowledge, this is the world first demonstration of completely new concept of the system and the method to overcome the metrology challenges we are currently facing.
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