Dr. Jukka-Tapani Mäkinen Profile

Dr. Jukka-Tapani Mäkinen

at VTT Technical Research Ctr of Finland Ltd

SPIE Involvement:

Author

Publications (18)

Proceedings Article | 31 March 2012 Open Access

Open Access

Paper

Printed hybrid systems

Pentti Karioja, Jukka-Tapani Mäkinen, Kimmo Keränen, Janne Aikio, Teemu Alajoki, Tuomo Jaakola, Matti Koponen, Antti Keränen, Mikko Heikkinen, Markus Tuomikoski, Riikka Suhonen, Leena Hakalahti, Pälvi Kopola, Jukka Hast, Ralf Liedert, Jussi Hiltunen, Noriyuki Masuda, Antti Kemppainen, Kari Rönkä, Raimo Korhonen

Proceedings Volume 8344, 83440G (2012) https://doi.org/10.1117/12.915206

KEYWORDS: Electronics, Manufacturing, Printing, Light emitting diodes, Organic light emitting diodes, Polymers, Neodymium, Sensors, Solar cells, Assembly equipment

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Proceedings Article | 14 May 2010 Paper

Paper

Optics cost modelling and design optimization

Jukka-Tapani Mäkinen, Sebastian Nollau

Proceedings Volume 7717, 77170G (2010) https://doi.org/10.1117/12.851313

KEYWORDS: Glasses, Optics manufacturing, Manufacturing, Modeling, Optical design, Lenses, Aspheric lenses, Glass molding, Coating, Optical components

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Proceedings Article | 16 May 2007 Paper

Paper

Inmould integration of a microscope add-on system to a 1.3 Mpix camera phone

Jukka-Tapani Mäkinen, Kimmo Keränen, Jehki Hakkarainen, Mikko Silvennoinen, Timo Salmi, Seppo Syrjälä, Anneli Ojapalo, Marcus Schorpp, Pekka Hoskio, Pentti Karioja

Proceedings Volume 6585, 658507 (2007) https://doi.org/10.1117/12.722741

KEYWORDS: Cameras, Light emitting diodes, Microscopes, Optics manufacturing, Integrated optics, Imaging systems, Optical design, Prototyping, Lens design, Image resolution

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Proceedings Article | 1 May 2007 Paper

Paper

Injection moulding integration of a red VCSEL illuminator module for a hologram reader sensor

Kimmo Keränen, Toni Saastamoinen, Jukka-Tapani Mäkinen, Mikko Silvennoinen, Ilpo Mustonen, Pasi Vahimaa, Timo Jääskeläinen, Ari Lehto, Anneli Ojapalo, Marcus Schorpp, Pekka Hoskio, Pentti Karioja

Proceedings Volume 6585, 658503 (2007) https://doi.org/10.1117/12.722700

KEYWORDS: Vertical cavity surface emitting lasers, Manufacturing, Prototyping, Fiber optic illuminators, Optics manufacturing, Optical alignment, Modeling, Diamond, Assembly tolerances, Packaging

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A red VCSEL illuminator module demonstrator was manufactured by injection moulding integration. A red VCSEL chip was first attached to a simple FR4 substrate, which contains bonding pads and conducting wires for the VCSEL chip attachment and electrical driving. The substrate was then placed as an insert in an injection mould. The VCSEL chip shielding and optics formation was made in a one-step injection moulding process. The used optical thermoplastic in the processing was polycarbonate (PC). The pursued optical function of the single spherical surface attained in the moulding was to collimate the emitted red light (&lgr;=664.5 nm) from the VCSEL chip. The main critical issue related to the manufacturing of the illuminator module in the injection moulding process was the durability of bonding wire contacts. A single 25 &mgr;m diameter gold wire was used in wire bonding in order to create the upper contact to the chip. The lower contact was processed by attaching the chip to the substrate using conductive epoxy. A test series of 20 modules using FR4 substrate materials were produced. The number of fully operative modules was 12 resulting total module yield of 60%. The main reason for a non-operative module was loosening of the bonding wire during the injection moulding process. The bonding wire durability in the moulding process can be improved by using glob-top shielding of the VCSEL device before injection moulding and using a lower holding pressure in the injection moulding process. A diamond turned insert was used in the mould in order to create a high quality lens surface on the top of the VCSEL chip. The tower average length after one iteration round by mould modification was 8.676 &mgr;m, so the measured value was on average 20 &mgr;m larger than nominal value. The measured RMS roughness of the processed lens surface was 5 ... 7 nm and the radius -3.23 ... 3.83 mm. The radius of the lens and the length of the tower varied depending of the used process parameters. The manufactured illumination module can be integrated with a CMOS image matrix sensor in order to form a compact hologram reader system. The injection moulding integration principle seems to be very promising method to manufacture intelligently integrated and cost-effective optoelectronic products according to experience with this demonstrator.

Proceedings Article | 21 April 2006 Paper

Paper

Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments

Mikko Karppinen, Teemu Alajoki, Antti Tanskanen, Kari Kataja, Jukka-Tapani Mäkinen, Pentti Karioja, Marika Immonen, Jorma Kivilahti

Proceedings Volume 6185, 61850O (2006) https://doi.org/10.1117/12.664386

KEYWORDS: Waveguides, Tolerancing, Microlens array, Optical alignment, Micromirrors, Receivers, Vertical cavity surface emitting lasers, Optical interconnects, Monte Carlo methods, Transmitters

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Proceedings Article | 21 April 2006 Paper

Paper

Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate

K. Keränen, J. Ollila, J.-T Mäkinen, K. Kautio, P. Korhonen, V. Heikkinen, O. Väätäinen, J. Heilala, P. Karioja

Proceedings Volume 6185, 61850N (2006) https://doi.org/10.1117/12.663753

KEYWORDS: Prototyping, Manufacturing, Tolerancing, Fiber lasers, Optical simulations, Modeling, Monte Carlo methods, Semiconductor lasers, Packaging, Glasses

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A hermetic fibre pigtailed laser module utilizing passive device alignment on a low temperature co-fired ceramics (LTCC) substrate is demonstrated. The 3-dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves and cavities for the laser to fibre coupling. The achieved passive alignment accuracy allows high coupling efficiency realizations of multi-mode fibre pigtailed laser modules. The ceramic substrate is intrinsically hermetic and it opens up a possibility to produce cost efficient hermetic packaging. In our concept hermetic sealing is produced by utilizing Kovar frame, which is soldered to an LTCC substrate. Kovar frame has a hole for fibre feed-trough and a hermetic glass-metal sealing between fibre and frame is processed using glass preform. The heart of the module is a power laser diode chip, which can produce several watts of continuous power. The module, however, can be finally used as a transmitter in a laser pulse time-of-flight distance sensor and in this application it can be overdriven by a factor of 10. This means that the peak optical power in the pulses can be several tens of watts. The laser chip allows this kind of overdriving due to the fact that the duty factor in the operation is only 0.0001 at 2 kHz pulsing frequency. Optical coupling efficiency of the multi-mode laser system was simulated using optical systems simulation software. The nominal coupling efficiency between 210 μm x 1μm stripe laser and 200/220 μm step index fibre (NA=0.22) was 0.65. The simulated coupling efficiency was verified by prototype realization and characterization. The measured average coupling efficiency of the hermetically sealed prototypes was 0.39. The coupling efficiencies of prototypes varied from 0.14 to 0.64. Leak rate of 1 x 10^-7 [atm x cm³/s] was measured in the helium leak tests for the final prototype module, when the module was tested according to MIL-STD-883D method 1014.9 specification. Leak rate for the module using a buffer stripper fibre without a rubber guard tube was 3 x 10^-9 [atm x cm³/s]. The background helium level before and after the tests was less than 3 x 10^-10[atm x cm³/s]. This clearly higher leak rate in the final module leak measurement is mainly due to the absorbed helium to the fibre polymer buffer layer and rubber guard tube in the pressurization process. Measurements show that the implemented module is hermetic. Cost-of-ownership modelling was performed starting from low production volume up to production of 10 million good modules per year. Module production cost was estimated through COO modelling. Modelling forecasted that the module production can be lower than 10 EUR in high volume production.

Proceedings Article | 20 October 2005 Paper

Paper

Implementing a prototyping network for injection moulded imaging lenses in Finland

K. Keränen, J.-T. Mäkinen, E.J. Pääkkönen, M. Koponen, M. Karttunen, J. Hiltunen, P. Karioja

Proceedings Volume 5965, 59651E (2005) https://doi.org/10.1117/12.625118

KEYWORDS: Prototyping, Lens design, Lenses, Manufacturing, Modulation transfer functions, Cameras, Optics manufacturing, Surface finishing, Tolerancing, Surface roughness

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A network for prototyping imaging lenses using injection moulding was established in Finland. The network consists of several academic and industrial partners capable of designing, processing and characterising imaging lenses produced by injection moulding technology. In order to validate the operation of the network a demonstrator lens was produced. The process steps included in the manufacturing were lens specification, designing and modelling, material selection, mould tooling, moulding process simulation, injection moulding and characterisation. A magnifying imaging singlet lens to be used as an add-on in a camera phone was selected as a demonstrator. The design of the add-on lens proved to be somewhat challenging, but a double aspheric singlet lens design fulfilling nearly the requirement specification was produced. In the material selection task the overall characteristics profile of polymethyl methacrylate (PMMA) material was seen to be the most fitting to the pilot case. It is a low cost material with good moulding properties and therefore it was selected as a material for the pilot lens. Lens mould design was performed using I-DEAS and tested by using MoldFlow 3D injection moulding simulation software. The simulations predicted the achievable lens quality in the processing, when using a two-cavity mould design. First cavity was tooled directly into the mould plate and the second cavity was made by tooling separate insert pieces for the mould. Mould material was steel and the inserts were made from Moldmax copper alloy. Parts were tooled with high speed milling machines. Insert pieces were hand polished after tooling. Prototype lenses were injection moulded using two PMMA grades, namely 6N and 7N. Different process parameters were also experimented in the injection moulding test runs. Prototypes were characterised by measuring mechanical dimensions, surface profile, roughness and MTF of the lenses. Characterisations showed that the lens surface RMS roughness was 30-50 nm and the profile deviation was 5 μm from the design at a distance of 0.3 mm from the lens vertex. These manufacturing defects caused that the measured MTF values were lower than designed. The lens overall quality, however, was adequate to demonstrate the concept successfully. Through the implementation of the demonstrator lens we could test effectively different stages of the manufacturing process and get information about process component weight and risk factors and validate the overall performance of the network.

Proceedings Article | 15 October 2005 Paper

Paper

Add-on laser reading device for a camera phone

Jukka-Tapani Mäkinen, Karri Niemelä, Hannu Vasama, Rauno Mattila, Mika Aikio, Sanna Aikio, Janne Aikio

Proceedings Volume 5962, 596228 (2005) https://doi.org/10.1117/12.625373

KEYWORDS: Cameras, Microscopes, Prototyping, Telescopes, Image sensors, Optical design, Manufacturing, Light emitting diodes, Image resolution, Mechanical engineering

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Proceedings Article | 8 September 2004 Paper

Paper

Embedded optical interconnect on printed wiring board

Mikko Karppinen, Jukka-Tapani Makinen, Kari Kataja, Antti Tanskanen, Teemu Alajoki, Pentti Karioja, Marika Immonen, Jorma Kivilahti

Proceedings Volume 5453, (2004) https://doi.org/10.1117/12.545931

KEYWORDS: Waveguides, Tolerancing, Vertical cavity surface emitting lasers, Monte Carlo methods, Transmitters, Receivers, Microlens array, Lenses, Polymers, Optical alignment

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Proceedings Article | 10 June 2004 Paper

Paper

Cost-effective packaging of laser modules using LTCC substrates

Kimmo Keranen, Jukka-Tapani Makinen, Juhani Heilala, Otso Vaatainen, Kari Kautio, Jyrki Ollila, Jarno Petaja, Mikko Karppinen, Veli Heikkinen, Pentti Karioja

Proceedings Volume 5358, (2004) https://doi.org/10.1117/12.528280

KEYWORDS: Tolerancing, Monte Carlo methods, Fiber lasers, Optical simulations, Optical alignment, Packaging, Semiconductor lasers, Manufacturing, Multimode fibers, Optics manufacturing

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Proceedings Article | 10 June 2004 Paper

Paper

Optical interconnect on printed wiring board

Mikko Karppinen, Jukka-Tapani Makinen, Kari Kataja, Antti Tanskanen, Teemu Alajoki, Pentti Karioja, Marika Immonen, Jorma Kivilahti

Proceedings Volume 5358, (2004) https://doi.org/10.1117/12.530350

KEYWORDS: Waveguides, Tolerancing, Monte Carlo methods, Transmitters, Vertical cavity surface emitting lasers, Receivers, Lenses, Sensors, Optical interconnects, Optical alignment

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Proceedings Article | 22 January 2004 Paper

Paper

Prototyping of miniature plastic imaging lens

Jukka-Tapani Makinen, Janne Aikio, Veli-Pekka Putila, Kimmo Keranen, Pentti Karioja, Timo Kolehmainen, Janne Haavisto

Proceedings Volume 5178, (2004) https://doi.org/10.1117/12.503480

KEYWORDS: Prototyping, Optics manufacturing, Optical design, Optomechanical design, Tolerancing, Manufacturing, Performance modeling, Design for manufacturability, Lens design, Image quality

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Proceedings Article | 22 January 2004 Paper

Paper

Simulation of imaging system's performance

Timo Kolehmainen, Janne Aikio, Mikko Karppinen, Antti-Jussi Mattila, Jukka-Tapani Makinen, Kari Kataja, Kari Tukkiniemi, Pentti Karioja

Proceedings Volume 5178, (2004) https://doi.org/10.1117/12.504330

KEYWORDS: Imaging systems, Image sensors, Sensors, Image quality, RGB color model, Lens design, Modulation transfer functions, Point spread functions, Visualization, Raster graphics

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Proceedings Article | 18 June 2002 Paper

Paper

Sol-gel technologies for multimode waveguide devices

Pentti Karioja, Maja Kusevic, Marianne Hiltunen, Janne Paaso, Jukka-Tapani Maekinen, Jussi Hiltunen, Kari Kautio, Harri Kopola

Proceedings Volume 4640, (2002) https://doi.org/10.1117/12.433291

KEYWORDS: Sol-gels, Waveguides, Tolerancing, Optical alignment, Ceramics, Systems modeling, Packaging, Optical lithography, 3D modeling, Manufacturing

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SPIE Journal Paper | 1 April 2002

Wireless infrared data links: ray-trace simulations of diffuse channelsand demonstration of diffractive element for multi-beam transmitters

Mikko Karppinen, Kari Kataja, Jukka-Tapani Maekinen, Sanna Aikio, Hannu Rajaniemi, Pertti Paeaekkoenen, Jari Turunen, Juha Rantala, Pentti Karioja

OE, Vol. 41, Issue 04, (April 2002) https://doi.org/10.1117/12.10.1117/1.1456538

KEYWORDS: Transmitters, Sensors, Monte Carlo methods, Scattering, Receivers, Vertical cavity surface emitting lasers, Computer simulations, Diffraction, Ray tracing, Data modeling

Proceedings Article | 13 December 2001 Paper

Paper

Free-space optical backplanes based on beaconlike links or on a ring bus

Mikko Karppinen, Jukka-Tapani Maekinen, Antti Kemppainen, Marianne Borenius, Pentti Karioja

Proceedings Volume 4455, (2001) https://doi.org/10.1117/12.450429

KEYWORDS: Receivers, Signal attenuation, Transmitters, Sensors, Vertical cavity surface emitting lasers, Tolerancing, Free space optics, Optical alignment, Optical interconnects, Mirrors

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Proceedings Article | 15 May 2001 Paper

Paper

Modeling of micro-optical systems by using nonsequential ray tracing

Sanna Aikio, Chen Liang, Jukka-Tapani Maekinen, Juha Rantala, Michael Descour

Proceedings Volume 4284, (2001) https://doi.org/10.1117/12.426863

KEYWORDS: Systems modeling, Ray tracing, Sensors, Waveguides, Chemical fiber sensors, Scattering, Light scattering, Silicon, Microscopes, Mirrors

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Proceedings Article | 27 April 2000 Paper

Paper

Ray-tracing simulations of free-space optical channels for impulse response studies of indoor data links

Mikko Karppinen, Sanna Aikio, Jukka-Tapani Maekinen, Hannu Rajaniemi, Pentti Karioja

Proceedings Volume 3952, (2000) https://doi.org/10.1117/12.384408

KEYWORDS: Sensors, Monte Carlo methods, Transmitters, Scattering, Receivers, Infrared radiation, Ray tracing, Optical simulations, Free space optics, Computer simulations

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Showing 5 of 18 publications

Conference Committee Involvement (5)

Optics, Photonics and Digital Technologies for Imaging Applications VII

6 April 2022 | Strasbourg, France

Optics, Photonics and Digital Technologies for Imaging Applications VI

6 April 2020 | Online Only, France

Optics, Photonics and Digital Technologies for Imaging Applications

24 April 2018 | Strasbourg, France

Optics, Photonics and Digital Technologies for Imaging Applications

5 April 2016 | Brussels, Belgium

Optics, Photonics and Digital Technologies for Multimedia Applications

16 April 2014 | Brussels, Belgium

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