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Kaori Warabi
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Publications (1)
Proceedings Article | 4 March 2019 Paper
Backside optical I/O module for Si photonics integrated with electrical ICs using fan-out wafer-level packaging technology
Hiroshi Uemura, Kaori Warabi, Kazuya Ohira, Yoichiro Kurita, Hideto Furuyama, Yoshiaki Sugizaki, Hideki Shibata
Proceedings Volume 10924, 1092416 (2019) https://doi.org/10.1117/12.2504855
KEYWORDS: Silicon, Semiconducting wafers, Optical fibers, Photonic integrated circuits, Photonics, Silicon photonics, Wafer-level optics, Wafer bonding, Receivers, Transmitters
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