The emergence of co-packaged optics and of parallel optics pluggable form factors with an increased number of fibers poses new challenges for optical packaging technologies. We describe micro-optical interposers manufactured with isothermal glass molding that enable the parallelized connection of large fiber arrays with photonic integrated circuits in a low-rise form factor as well as the management of scrambled light polarization from a remote laser source coupled by single mode fiber. A resonantly assisted but temperature tolerant silicon photonics Mach-Zehnder modulator operated in lumped element configuration is co-developed for that purpose and a concept for a 6.4 Tb/s bi-directional light engine described.
We present work towards a visible wavelength tuneable external cavity laser (ECL) on a silicon nitride platform working around 640 nm. A ring resonator Vernier structure on the photonic integrated circuit (PIC) provides delayed feedback with spectral filtering and tuning. Gain is provided by a reflective semiconductor optical amplifier (SOA) grown on a GaAs substrate and integrated by pick-and-place flip-chip assembly. In a novel coupling scheme, the 1-dB in-plane placement tolerance is relaxed by a multi-mode edge-coupler to ± 2.6 µm in the direction parallel to the SOA edge and to displacements up to 3.5 µm from the PIC interface along the SOA’s optical axis. Pedestals defined in the PIC guarantee vertical alignment.
We report on glass-molded micro-optical interposers for single-mode fiber-to-PIC coupling fabricated in parallel by isothermal molding of 1-inch glass plates yielding over 100 arrays of 8 lenses each. Excess losses between PIC and singlemode fiber are below 1 dB. In addition to allowing a narrow package footprint, beam transformation maps mode profiles between fibers and surface couplers, and, in case of grating couplers, can adapt the light incidence angle on a wavelengthspecific basis, facilitating packaging of PICs in CWDM and LAN-WDM modules. The interposers can be further extended to support polarization management and isolation by coating with polarization selective thin film stacks in MacNeille configuration, as well as wavelength multiplexing by coating with dichroic stacks. Using this technique, over 256 bidirectional transceiver channels can be packaged in the footprint of a single reticle.
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