Mr. Michael B. Pike Profile

Michael B. Pike

at GLOBALFOUNDRIES Inc

SPIE Involvement:

Author

Publications (7)

SPIE Journal Paper | 2 May 2016

Intrafield overlay correction for illumination-based distortion

Michael Pike, Timothy Brunner, Bradley Morgenfeld, Nan Jing, Timothy Wiltshire

JM3, Vol. 15, Issue 02, 021406, (May 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.2.021406

KEYWORDS: Overlay metrology, Distortion, Scanners, Reticles, Image processing, Semiconducting wafers, Error analysis, Optical alignment, Photomasks, Calibration

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Proceedings Article | 18 March 2015 Paper

Intra-field overlay correction for illumination based distortion

Michael Pike, Timothy Brunner, Bradley Morgenfeld, Nan Jing, Timothy Wiltshire

Proceedings Volume 9426, 942613 (2015) https://doi.org/10.1117/12.2085887

KEYWORDS: Overlay metrology, Scanners, Distortion, Reticles, Semiconducting wafers, Optical lithography, Photomasks, Optical alignment, Lithographic illumination, Error analysis

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Proceedings Article | 31 March 2014 Paper

Characterization and mitigation of overlay error on silicon wafers with nonuniform stress

T. Brunner, V. Menon, C. Wong, N. Felix, M. Pike, O. Gluschenkov, M. Belyansky, P. Vukkadala, S. Veeraraghavan, S. Klein, C. H. Hoo, J. Sinha

Proceedings Volume 9052, 90520U (2014) https://doi.org/10.1117/12.2045715

KEYWORDS: Semiconducting wafers, Overlay metrology, Electronic support measures, Distortion, Optical alignment, Metrology, Photomasks, Lithography, Silicon, Laser range finders

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Proceedings Article | 4 April 2012 Paper

High-order wafer alignment in manufacturing

Michael Pike, Nelson Felix, Vinayan Menon, Christopher Ausschnitt, Timothy Wiltshire, Sheldon Meyers, Won Kim, Blandine Minghetti

Proceedings Volume 8324, 832408 (2012) https://doi.org/10.1117/12.916483

KEYWORDS: Optical alignment, Semiconducting wafers, Overlay metrology, Scanners, Manufacturing, Control systems, Semiconductor manufacturing, Data modeling, Process control, Metrology

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Proceedings Article | 4 March 2010 Paper

The GridMapper challenge: how to integrate into manufacturing for reduced overlay error

Allen Gabor, Bernhard Liegl, Michael Pike, Emily Hwang, Timothy Wiltshire

Proceedings Volume 7640, 764015 (2010) https://doi.org/10.1117/12.849225

KEYWORDS: Overlay metrology, Semiconducting wafers, Scanners, Manufacturing, Reticles, Lithography, Optics manufacturing, Laser scanners, 3D scanning, Software development

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Proceedings Article | 23 March 2009 Paper

Cr migration on 193nm binary photomasks

John Bruley, Geoffrey Burr, Robert Davis, Philip Flaitz, William Hinsberg, Frances Houle, Dolores Miller, Michael Pike, Jed Rankin, Alfred Wagner, Andrew Watts

Proceedings Volume 7272, 727215 (2009) https://doi.org/10.1117/12.813934

KEYWORDS: Photomasks, Chromium, Semiconducting wafers, Binary data, Manufacturing, Diffusion, Transmission electron microscopy, Roads, Photoresist materials, Oxidation

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Proceedings Article | 7 July 1997 Paper

New ESCAP-type resist with enhanced etch resistance and its application to future DRAM and logic devices

Will Conley, William Brunsvold, Fred Buehrer, Ronald DellaGuardia, David Dobuzinsky, Timothy Farrell, Hok Ho, Ahmad Katnani, Robin Keller, James Marsh, Paul Muller, Ronald Nunes, Hung Ng, James Oberschmidt, Michael Pike, Deborah Ryan, Tina Cotler-Wagner, Ron Schulz, Hiroshi Ito, Donald Hofer, Gregory Breyta, Debra Fenzel-Alexander, Gregory Wallraff, Juliann Opitz, James Thackeray, George Barclay, James Cameron, Tracy Lindsay, Michael Cronin, Matthew Moynihan, Sassan Nour, Jacque Georger, Mike Mori, Peter Hagerty, Roger Sinta, Thomas Zydowsky

Proceedings Volume 3049, (1997) https://doi.org/10.1117/12.275830

KEYWORDS: Semiconducting wafers, Photoresist materials, Etching, Polymers, Resistance, Lithography, Silicon, Glasses, Annealing, Photoresist processing

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Showing 5 of 7 publications

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