The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from amorphous
silicon has enabled ULIS to develop VGA IRFPA formats with 17 μm pixel-pitch, hence building up the currently
available product catalog. This detector keeps all the innovations developed on the 25 μm pixel-pitch ROIC (detector
configuration by serial link, low power consumption and wide electrical dynamic range). The specific appeal of this unit
lies in the high spatial resolution it provides. The pixel-pitch reduction turns this TEC-less VGA array into a product
well adapted for high resolution and compact systems. Electro-optical performances of this IRFPA are presented
hereafter as well as recent performance improvement. We will focus on NETD trade-off with wide thermal dynamic
range, as well as the high characteristics uniformity and pixel operability, achieved thanks to the mastering of
amorphous silicon technology coupled with the ROIC design. Solar exposure is also taken into account and shows that
ULIS amorphous silicon is perfectly well suited to sustain high intensity exposure. This technology node associated
with advanced packaging technique paves the way to compact low power system.
For more than 10 years now, uncooled sensors have given new opportunities in the IR field of
applications by being able to be produce in large volume. Compared to cooled technology, uncooled
detectors offer many interesting advantages: high reliability, lower cost ... whereas the performance
is high enough for a lot of applications. Thermography, building inspection, enhanced driver vision
and military (thermal weapon sight, low altitude UAV sensor) are applications which can be
provided with affordable IR focal plane arrays...
As uncooled IR sensors are mainly dedicated to these high volume applications, any uncooled
IRFPA technology has to be able to provide high performance sensors but also to be producible in
large volume at a minimum cost.
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers
made from amorphous silicon layer enables ULIS to develop a full range of IRFPA formats from
160x120 to 1024x768 pixels with 25μm and 17μm pixel-pitch, designed for high end and high
volume applications.
The detector ROIC designs rely on a simple architecture (detector configuration addressed by a
serial link for user defined amplifier gain, windowing capability...) which enables easier systems
upgrade and therefore a reduced system development non recurrent cost.
The packaging technique depends on the application environment and the production volume in
order to fit with the market expectation. Starting from metallic and ceramics package, very
advanced new technique is under development in order to reduce uncooled IRFPA production cost.
NETD in the range of 30mK (f/1, 300K, 60Hz) as well as operability higher than 99.99%, are
routinely achieved with amorphous silicon technology.
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from amorphous silicon layer enables ULIS to develop 384 × 288 (1/4 VGA) IRFPA formats with 25 μm pixel-pitch designed for high end applications.
This detector ROIC design relies on the same architecture as the full TV format ROIC one (detector configuration by serial link, user defined amplifier gain, windowing capability ...). The detector package is identical as the 384 × 288 / 35 μm and 640 × 480 / 25μm ones, enabling an easier system update or less non recurrent cost for different systems developments.
This paper will give results of the IRFPA characterization. NETD in the range of 30mK (f/1, 300 K, 60 Hz) and operability higher than 99.99 % are routinely achieved.
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 × 288 (1/4 VGA) IRFPA format with 25 μm pixel-pitch designed for low end application.
This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range...). The specific appeal of this unit lies in the miniaturization of the TEC-less (Thermo-Electric Cooler) package and its extremely light weight. The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production.
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from
amorphous silicon enables ULIS to develop 1024 x 768 (XGA) IRFPAs with 17 μm pixel-pitch to build up the
currently available product catalog.
This detector has kept all the innovations developed on the full TV format Read Out Integrated Circuit (ROIC)
(detector configuration by serial link, two video outputs, low power consumption and wide electrical dynamic range
...). The specific appeal of this unit lies in the high image resolution it provides. The reduction of the pixel-pitch
turns this XGA array into a product well adapted for high resolution and compact systems.
In the last part of the paper, we will look more closely at high electro-optical performances of this IRFPA; we will
highlight the wide thermal dynamic range as well as the high characteristics uniformity and high pixel operability
achieved thanks to the mastering of the amorphous silicon technology coupled with the ROIC design.
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from amorphous silicon layer enables ULIS to develop 384 x 288 (1/4 VGA) IRFPA formats with 25 μm pixel-pitch designed for high end applications.
This detector ROIC design relies on the same architecture as the full TV format ROIC one (detector configuration by serial link, user defined amplifier gain, windowing capability ...). The detector package is identical as the 384 x 288 / 35 μm and 640 x 480 / 25 μm ones, enabling an easier system update or less non recurrent cost for different systems developments.
This paper will give results of the IRFPA characterization. NETD in the range of 30 mK (f/1, 300 K, 60 Hz) and operability higher than 99.99 % are routinely achieved.
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 x 288 (1/4 VGA) IRFPA format with 25 μm pixel-pitch designed for low end application.
This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range ...). The specific appeal of this unit lies in the miniaturization of the TEC-less (Thermo-Electric Cooler) package and its extremely light weight. The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production.
We will present first the simple TEC-less operating mode which has been developed. The electro-optical characterization versus environmental temperature will be presented.
The European Space Agency (ESA) has committed to a multi-spacecraft Cornerstone mission to the planet Mercury.
BepiColombo comprises two spacecraft, one of which (The Mercury Planetary Orbiter platform (MPO)) will contain
remote sensing instruments for making measurements of the planet at wavelengths from the far infrared to γ-rays. The
MERcury Thermal Infrared Spectrometer (MERTIS) measures spectral emittance from Mercury in the range from 7 to
14 μm to derive surface mineralogy. It will employ an uncooled IR focal plane array (IRFPA) at the heart of the
spectrometer. Within this framework, the IRFPA has been developed from a 160 × 120 microbolometer array with a
pixel pitch of 35 μm. This sensor is made from amorphous silicon, which yields a short thermal time constant as well as
very low NETD. Specific attention has been paid to the fact that such detector has to operate in space environment. The
paper will present the specific development under progress and the first results obtained to fulfil the MERTIS
requirements in terms of performance, irradiative and mechanical environments.
This paper reviews the specifications and performances of a 160 × 120 uncooled infrared focal plane array made from
amorphous silicon microbolometers with a pixel-pitch of 25 μm, integrated into a LCC TEC-less package. This detector
has been specifically designed for large volume production, while keeping the main features of high end developments,
at detection pixel level, as well as at ROIC level, like detector configuration by serial link in order to minimize the
number of electrical inputs, low power, large dynamic range...) The main particular features of this achievement are the
miniaturized very low weight package, along with easy TEC-less operation naturally afforded via the readout
architecture, which leads to very low consumption levels, making it well adapted to low end hand held or helmet
mounted thermal imaging cameras. We present in the last part of this paper the main electro-optical characteristics and
TEC-less operation, demonstrating wide thermal dynamic range and low power, thanks to the simple single-level
amorphous silicon technology, coupled with advanced ROIC design.
This paper reviews specifications and performances of a 160 x 120 uncooled infrared focal plane array made from
amorphous silicon micro bolometer with a pixel-pitch of 25 μm, integrated in a LCC package. This detector has been
specifically designed for being produced in large volume. The detector has kept all the innovations developed on the
full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range... ) and offers an advanced TEC-less focal plane array well adapted to low end thermal imaging cameras. The specific
appeal of this unit lies in the miniaturization of the packaging and its extremely light weight.In the last part of the paper,
we will look more closely at electro-optical performances of this TEC-less product 160 x 120 as well as the other 25 μm
products like the 384 x 288. We will insist on the wide thermal dynamic range and the low consumption achieved
thanks to the mastering of the amorphous silicon technology coupled with the innovation in the ROIC design.
This paper reviews specifications and performances of a 160 x 120 uncooled infrared focal plane array made from
amorphous silicon micro bolometer with a pixel-pitch of 25 μm, integrated in a LCC package and mass production
oriented.
This new 25 μm pixel design benefits from a higher pixel thermal insulation while keeping low thermal time constant.
Furthermore, we developed this new 25 μm version on the basis of the well mastered 35 μm pixel-pitch technology.
Thanks to this new pixel design and by pushing the design rules even further, a high fill factor has been kept, without the
use of a complex, as well as an expensive, two-level structure.
The detector is described in terms of readout integrated circuit (ROIC) architecture, packaging, operability and electro-optical
performances.
A new read out integrated circuit structure has been designed specifically for this detector. High level functions like gain,
image flip and integration time could be operated through a serial link to minimize the number of electrical
interconnections.
In addition, a small LCC package has been developed enabling mass production dedicated to compact hand held or
helmet mounted cameras.
This paper reviews characteristics and performance of the amorphous silicon microbolometers with a pixel-pitch of 25 μm. We first present the advantages of amorphous silicon uncooled microbolometer technology which enables the production of high volume and low cost uncooled IRFPA. The 25 μm pixel architecture profits from the low thermal time constant of 45 μm pixel detector, to design higher thermal insulated pixel. It enables the development of a 25 μm pixel-pitch detector which has high performance despite the pixel pitch reduction. Thanks to this new pixel design and by pushing the design rules even further, high fill factor has been kept, without the use of complex, as well as expensive, two-level structure. IRFPAs are then described in terms of ROIC architecture, packaging, operability and electro-optical performances. New readout integrated circuit structure has been specially developed for this pixel pitch. High level functions like gain, offset correction, image flip and windowing could be operated through a serial link to simplify the electrical interface.
At a 60Hz frame rate, focal planes with less than 50mK (f/1) NETD are now achieved with high stability regarding environmental temperature.
This paper reviews characteristics and performance of the first 640 x 480 made from amorphous silicon microbolometers with a pixel-pitch of 25 μm. The full TV format IRFPA product is then described in terms of ROIC architecture, packaging, operability and electro-optical performances. The pixel architecture profits from the low thermal time constant which characterizes the amorphous silicon technology, to design a high performance 640 x 480 array. A new read out integrated circuit structure has been specially developed for this array. High level functions like gain, windowing and image flip could be operated through a serial link to minimize the number of electrical interconnections. At a 60Hz frame rate, focal planes with NETD less than 50mK (f/1) are now achieved with low spatial fixed pattern noise after sensor gain and offset compensation. Thanks to a new pixel design and by pushing the design rules even further, a high fill factor has been kept, without the use of complex, as well as expensive, two-level structure. This new detector has been qualified for production since September 2005.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Fire-fighting, predictive maintenance. process control and thermography are a few of the industrial applications which could take benefit from uncooled infrared detector. Therefore, to answer these markets, a 35 μm pixel-pitch uncooled IR detector technology has been developed enabling high performance 160 x 120 and 384 x 288 arrays production. Besides a wide-band version from uncooled 320 x 240 / 45 μm array has been also developed in order to address process control and more precisely industrial furnaces control. The ULIS amorphous silicon technology is well adapted to manufacture low cost detector in mass production. After some brief microbolometer technological background, we present the characterization of 35 μm pixel-pitch detector as well as the wide-band 320 x 240 infrared focal plane arrays with a pixel pitch of 45 μm.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Firefighting, predictive maintenance, process control and thermography are a few of the industrial applications which could take benefit from uncooled infrared detector. Therefore, to answer these markets, a 35 μm pixel-pitch uncooled IR detector technology has been developed enabling high performance 160 x 120 and 384 x 288 arrays production. Besides a wide-band version from uncooled 320 x 240 / 45 μm array has been also developed in order to address process control and more precisely industrial furnaces control. The ULIS amorphous silicon technology is well adapted to manufacture low cost detector in mass production. After some brief microbolometer technological background, we present the characterization of 35 μm pixel-pitch detector as well as the wide-band 320 x 240 infrared focal plane arrays with a pixel pitch of 45 μm.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Firefighting, predictive maintenance, process control and thermography are a few of the industrial applications which could take benefit from uncooled infrared detector. Therefore, to answer these markets, a 35 μm pixel-pitch uncooled IR detector technology has been developed enabling high performance 160 x 120 and 384 x 288 arrays production. Besides a wide-band version from uncooled 320 x 240 / 45 μm array has been also developed in order to address process control and more precisely industrial furnaces control. The ULIS amorphous silicon technology is well adapted to manufacture low cost detector in mass production. After some brief microbolometer technological background, we present the characterization of 35 μm pixel-pitch detector as well as the wide-band 320 x 240 infrared focal plane arrays with a pixel pitch of 45 μm.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Fire-fighting, predictive maintenance, process control and thermography are a few of the industrial applications which could take benefit from uncooled infrared detector. Therefore, to answer these markets, a 35 μm pixel-pitch uncooled IR detector technology has been developed enabling high performance 160 x 120 and 384 x 288 arrays production. Besides a wide-band version from uncooled 320 x 240 / 45 μm array has been also developed in order to address process control and more precisely industrial furnaces control. The ULIS amorphous silicon technology is well adapted to manufacture low cost detector in mass production. After some brief microbolometer technological background, we present the characterization of 35 μm pixel-pitch detector as well as the wide-band 320 x 240 infrared focal plane arrays with a pixel pitch of 45 μm.
This paper reviews ULIS’progress, on 35 μm pitch, in amorphous silicon uncooled microbolometer focal plane (UFPA) technology and product development over the last year. The ULIS FPA products have been described in great detail, including product capabilities and complete EO performances. At 60 Hz frame rate, focal planes with 40 mK (f/1) NETD are now achieved in production with a spatial fixed pattern noise lower than 25 mK after gain and offset compensation. Key improvements, compared to 45 μm pitch technology, have been the achievement of microbolometer resistance uniformity better than 0.5 % (standard deviation) on the IRFPA die for the different formats. Thanks to a new pixel design, high fill factor along with low thermal time constant (7 ms), 35 μm pitch amorphous silicon UFPAs are prime candidates for FLIR applications.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. ULIS now offers a new type of detector for middle and long wave applications. This detector has been designed from the standard product using the same focal plane array and the same package, only the window is different in terms of spectral transmission. This device is well adapted to high temperature measurements, special industrial processes and gas detection. After some brief microbolometer technological background, we will present the interest for such detectors by comparing LWIR/MWIR detector signal to noise ratio, we will then determine the advantages for different applications. Finally, we will describe and give the main EO characteristics and performances of this Ulis product.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. CEA/LETI developments are focused on the improvement of their sensitivity enabling the possibility to reduce the pixel pitch and the decrease of the system cost by using smaller optics. We present the characterization of a 160 x 120 infrared focal plane array with a pixel pitch of 35 μm. The amorphous silicon based technology is using recent process enhancement developed by CEA/LETI and transferred to ULIS. ULIS developed for this device a low cost package. The readout integrated circuit structure is using an advanced skimming function to enhance the pixel signal exploitation. This device is well adapted to high volume infrared imaging applications where spatial resolution (in term of pixel number) is less important than cost. The electro-optical characterization is presented. Besides, a unique and high precision molding technology has been developed by Umicore IR Glass to produce low cost chalcogenide infrared glass lenses with a high performance level. Spherical, aspherical and asphero-diffractive lenses have been manufactured with very accurate surface precision. The performances are comparable to those of an optic made with aspherical germanium. This new glass named GASIR offers an alternative solution to germanium for thermal imaging, especially for medium and high volumes applications. These two key technologies are well adapted to develop infrared driver vision enhancement (DVE) system for commercial application. A European project named ICAR has been setting up to exploit these advantages. An overview of the project will be given.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Developments are focused on the improvement of their sensitivity enabling the possibility of reducing the pixel pitch in order to decrease the total system size and weight by using smaller optics.
We present the ULIS second generation technology used for producing 320 x 240 (384 x 288) and 160 x 120 IRFPA with a pixel pitch of 35 µm. This enhanced technology was developed by CEA / LETI and has been transferred to ULIS in 2003. The device architecture will be described. This device is well adapted to high volume military applications (i.e. thermal weapons sight, enhanced driver vision) and commercial applications (i.e. predictive maintenance, firefighting, thermography, medical,...) where specifications are the result of a trade-off between pixel pitch, performance and system weight. We have developed for these devices low cost packages. IRFPA electro-optical characterization is presented.
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Developments are focused on the improvement of their sensitivity enabling the possibility of reducing the pixel pitch in order to decrease the total system size and weight by using smaller optics.
We present the ULIS second generation technology used for producing 320 x 240 / 384 x 288 and 160 x 120 IRFPA with a pixel pitch of 35 μm. This enhanced technology has been developed by CEA / LETI since 2001 and transferred to ULIS in 2003.
The device architecture will be described. These device are well adapted to high volume military applications (i.e. thermal weapons sight, enhanced driver vision) or commercial applications (non contact thermometers, thermal imaging cameras...) where system specifications are the result of a trade-off between pixel pitch, performance and system weight and volume. We have developed for these devices low cost packages. IRFPA electro-optical characterization is presented.
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