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Pan Liu
at Anchor Semiconductor, Inc.
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Author
Publications (1)
Proceedings Article | 20 March 2019 Paper
Novel pattern-centric solution for high performance 3D NAND VIA dishing metrology
Proceedings Volume 10962, 1096217 (2019) https://doi.org/10.1117/12.2524569
KEYWORDS: Metrology, Semiconducting wafers, Image processing, Metals, 3D metrology, Atomic force microscopy, Chemical mechanical planarization, 3D image processing, Wafer bonding, Data processing
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