Dr. R. Scott Mackay Profile

Dr. R. Scott Mackay

Consultant at Petersen Advanced Lithography Inc

SPIE Involvement:

Author

Proceedings Article | 19 May 2006 Paper

Mask repair technique assessment and development for the 45nm lithographic node

H. Marchman, D. Taylor, S. Hadisutjipto, S. Mackay, R. Cottle, J. Maltabes, J. Brown

Proceedings Volume 6283, 628311 (2006) https://doi.org/10.1117/12.681862

KEYWORDS: Photomasks, Ions, Etching, Ion beams, Lithography, Molecules, Electron beams, Image resolution, Scanning electron microscopy, Signal to noise ratio

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Proceedings Article | 9 November 2005 Paper

An integrated approach to the analysis of imprint vs. optical lithography, or why this is not just a mask discussion

John Maltabes, R. Scott Mackay, Rand Cottle

Proceedings Volume 5992, 59924A (2005) https://doi.org/10.1117/12.632207

KEYWORDS: Lithography, Photomasks, Manufacturing, Semiconductors, Reticles, Etching, Optical lithography, Semiconducting wafers, Nanoimprint lithography, Inspection

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Proceedings Article | 7 November 2005 Paper

Mask lithography assessment for 45 nm node technology

R. Scott Mackay, Henry Kamberian, Barry Rockwell

Proceedings Volume 5992, 59920S (2005) https://doi.org/10.1117/12.633550

KEYWORDS: Photomasks, Vestigial sideband modulation, Metrology, Lithography, Error analysis, Electron beam lithography, Manufacturing, Composites, Metals, Semiconductors

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Proceedings Article | 18 August 2005 Paper

Current imprint template commercial manufacturing capability for nanotechnology and existing semiconductor and MEMS markets

John Maltabes, Scott Mackay, Rand Cottle

Proceedings Volume 5931, 59311H (2005) https://doi.org/10.1117/12.629499

KEYWORDS: Lithography, Manufacturing, Semiconductors, Photomasks, Etching, Reticles, Microelectromechanical systems, Optical lithography, Optics manufacturing, Nanotechnology

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Proceedings Article | 5 May 2005 Paper

Device and lithography contextual mask rule generation

Young Mog Ham, Brian Dillon, Chris Progler, Kory Goldammer, Zhiziang Jin, Gary Green, R. Scott Mackay, Hitendra Divecha, Victor Boksha, Pat Martin, Mitch Heins, Yuan Zhang, Kurt Davis, Rafik Marutyan, Karen Martirosyan, Sergei Bakarian

Proceedings Volume 5756, (2005) https://doi.org/10.1117/12.600730

KEYWORDS: Photomasks, Semiconducting wafers, Optical proximity correction, Lithography, Critical dimension metrology, Manufacturing, Resolution enhancement technologies, Electron beam lithography, Mask making, Design for manufacturing

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Proceedings Article | 27 January 2005 Paper

Photomask development for 90-nm technology

Yuan Zhang, Rand Cottle, Scott Mackay, Guangming Xiao, James Unruh, Christopher Progler

Proceedings Volume 5645, (2005) https://doi.org/10.1117/12.570482

KEYWORDS: Photomasks, Manufacturing, Lithography, Chromium, Binary data, Quartz, Semiconductors, Phase shifts, SRAF, Etching

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Proceedings Article | 16 June 2003 Paper

Reduction of image placement errors in EPL masks

Obert Wood, Phillip Reu, Roxann Engelstad, Edward Lovell, Michael Lercel, Carey Thiel, Mark Lawliss, R. Mackay

Proceedings Volume 5037, (2003) https://doi.org/10.1117/12.490136

KEYWORDS: Photomasks, Reticles, Silicon, Semiconducting wafers, Mask making, Metrology, Electron beam lithography, Optical alignment, Projection lithography, Lithography

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Proceedings Article | 28 May 2003 Paper

Through the looking glass: what is on the horizon for the mask maker?

R. Scott Mackay, Benjamin Eynon, Dhirendra Mathur

Proceedings Volume 5148, (2003) https://doi.org/10.1117/12.514946

KEYWORDS: Photomasks, Manufacturing, Lithography, Extreme ultraviolet lithography, Glasses, Mask making, Pellicles, Inspection, Optical lithography, Semiconducting wafers

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SPIE Journal Paper | 1 April 2003

Predicting overlay performance for electron projection lithography masks

Phillip Reu, Cheng-Fu Chen, Roxann Engelstad, Edward Lovell, Michael Lercel, Obert Wood, R. Mackay

JM3, Vol. 2, Issue 02, (April 2003) https://doi.org/10.1117/12.10.1117/1.1563646

KEYWORDS: Photomasks, Mask making, Manufacturing, Electron beam lithography, Performance modeling, Projection lithography, Finite element methods, 3D modeling, Device simulation, Semiconducting wafers

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Proceedings Article | 1 July 2002 Paper

NGL process and the role of International SEMATECH

Giang Dao, R. Mackay, Philip Seidel

Proceedings Volume 4688, (2002) https://doi.org/10.1117/12.472289

KEYWORDS: Extreme ultraviolet lithography, Photomasks, Lithography, Extreme ultraviolet, Optics manufacturing, Manufacturing, EUV optics, X-rays, Resolution enhancement technologies, X-ray technology

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International SEMATECH (ISMT) established a program in 1996 to narrow the Next Generation Lithography (NGL) options on the SIA Roadmap through a global consensus process. Methodologies developed by the SIA Lithography Technical Working Group (TWG) were adopted to ensure a balanced and objective assessment. Critical reviews with emphasis on technical program plans, solutions to critical issues (showstoppers), error budget analysis, cost-of-ownership, business plans, and schedules were implemented with the Technical Champions of each technology. White papers were written by the Technical Champion teams to better educate the participants in the annual worldwide NGL workshops. Participants made their recommendations through a survey conducted at the end of each workshop. A Task Force of the key stakeholders from global chip makers, equipment suppliers and consortia was commissioned to review the workshop output, assess the progress on the critical issues and make recommendations to ISMT on narrowing the options. As a result of this global consensus process and the critical issue projects, the NGL Task Force has made the following recommendations: (i) November 1997 - Massively Parallel Direct Write (MPDW) is not mature enough for introduction until at least the 50nm node. (ii) December 1998 - ISMT should narrow its support to two options EUVL and EPL, and that other worldwide activity on X-Ray and IPL continue. (iii) December 1999 - ISMT should continue its support for EUVL and EPL for the 70nm node, it also recognized the growing possibility that the industry might need more than one mainstream technology for the diverging application of DRAM/MPU and ASIC/SOC. (iv) September 2000 - The industry in general should narrow its support for commercialization to EUVL and EPL for insertion at the 70nm node. (v) August 2001 - The industry should continue to fund the commercialization of both EUVL and EPL. Today, the ISMT program for NGL is transitioning from option selection to promoting critical issues solutions and commercial infrastructure for EUVL with initial focus on mask blanks. ISMT is also pursuing collaboration with the suppliers and consortia developing EPL technology to provide stable stencil mask for contact layers. This paper describes the evolution of the program, results of the year 2001 activities, and the plans for 2002.

Proceedings Article | 1 July 2002 Paper

Predicting overlay performance for electron projection lithography masks

Phillip Reu, Cheng-Fu Chen, Roxann Engelstad, Edward Lovell, Michael Lercel, Obert Wood, R. Mackay

Proceedings Volume 4688, (2002) https://doi.org/10.1117/12.472280

KEYWORDS: Photomasks, Mask making, Electron beam lithography, Projection lithography, Manufacturing, Semiconducting wafers, Silicon, Etching, Control systems, Finite element methods

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Proceedings Article | 5 July 2000 Paper

Influence of film stress on advanced optical reticle distortions

Lowell Siewert, Andrew Mikkelson, Roxann Engelstad, Edward Lovell, Mark Mason, R. Mackay

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.389008

KEYWORDS: Reticles, Etching, Thin films, Photomasks, Metrology, Optical lithography, Optical alignment, Chromium, Chemical elements, Mask making

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Proceedings Article | 5 June 1998 Paper

Materials for reflective multilayer coatings for EUV wavelengths

Bruce Smith, Parthasarathy Venkataraman, Santosh Kurinec, R. Mackay

Proceedings Volume 3331, (1998) https://doi.org/10.1117/12.309614

KEYWORDS: Multilayers, Reflectivity, Extreme ultraviolet, Optical coatings, Molybdenum, Silicon, Interfaces, Beryllium, Thin film coatings, Mirrors

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Proceedings Article | 7 July 1997 Paper

Interferometric lithography exposure tool for 180-nm structures

Saleem Zaidi, Steven Brueck, Franklin Schellenberg, R. Mackay, K. Uekert, Jeffrey Persoff

Proceedings Volume 3048, (1997) https://doi.org/10.1117/12.275785

KEYWORDS: Semiconducting wafers, Lithography, Interferometry, Wafer-level optics, Photoresist processing, Digital signal processing, Laser sources, Photoresist materials, Manufacturing, Optical lithography

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