Maintaining photon absorption in optically thin III-V multijunction space photovoltaics can be accomplished by integrating back surface reflectors (BSR) to increase the photon path length inside the thin solar cell and enhance the photogenerated current. This research investigates the integration of textured BSRs with thin-film 1-eV InGaAs solar cells to improve radiation tolerance and maintain device performance of thin-film inverted metamorphic (IMM) solar cells. The developed textures include surface treatments using reactive-ion etching (RIE) and in situ processing during the epitaxial growth of the solar cells. The textured layers achieve higher surface roughness than the pre-textured surface, indicating angular photon scattering. The InGaAs solar cells with textured BSRs show an increase in the short-circuit current density compared to the flat BSR with no degradation in the open-circuit voltage. The planar and RIE BSR solar cells result in lifetime enhancement factors of 2.4 and 3.6, respectively, indicating an increased photon path length due to the textured reflector. Improving the photon path length in the ultrathin InGaAs solar cells can be accomplished by using a low-index total internal reflection layer between the textured semiconductor and mirror. The results and discussion provided in this work support the integration of 600 nm-thick InGaAs subcells into a standard IMM design to achieve highly efficient and radiation-hardened space photovoltaic devices.
KEYWORDS: Tolerancing, Solar radiation, Multijunction solar cells, Mirrors, Indium gallium arsenide, Solar cells, Diffusion, Wet etching, Solar energy, Resistance
Loss in output power in multi-junction space photovoltaics occurs due to reduction in minority carrier diffusion length caused by on-orbit radiation damage of the crystal. One method to improve the radiation resistance of a multi-junction device is through thickness reduction of the various layers, increasing carrier collection at reduced diffusion length. However, this reduction in thickness can also result in current loss unless some type of mirror is used to increase the optical path length (OPL). In this talk, we will explore two options for increasing the OPL in the middle and bottom junction of a standard InGaP2/GaAs/In0.3Ga0.7As inverted metamorphic (IMM) solar cell using a chirped distributed Bragg reflector (DBR) between the GaAs and InGaAs cell and using a maskless texture at the back side of the InGaAs cell. The fabrication of these structures will be reviewed as well as device and radiation improvements afforded by application of the photonic structures.
Yongkun Sin, Mark Peterson, Zachary Lingley, Stephen LaLumondiere, Steven Moss, Honghyuk Kim, Kamran Forghani, Yingxin Guan, Kangho Kim, Jaejin Lee, Luke Mawst, Thomas Kuech, Rao Tatavarti
III-V multi-junction solar cells are based on a triple-junction design that consists of an InGaP top junction, a GaAs middle junction, and a bottom junction that employs either a 1eV material grown on the GaAs substrate or InGaAs grown on the Ge substrate. The most promising 1 eV materials under extensive investigation are the bulk dilute nitride such as InGaAsN(Sb) lattice-matched to GaAs substrate and the dilute-bismide quantum well materials, such as GaAsBi, strain-compensated with GaAsP barriers. Both approaches have the potential to achieve high performance triple-junction solar cells. In addition, space satellite applications utilizing III-V triple-junction solar cells can have significantly reduced weight and high efficiency. An attractive approach to achieve these goals is to employ full-wafer epitaxial lift off (ELO) technology, which can eliminate the substrate weight and also enable multiple substrate re-usages. For the present study, we employed time-resolved photoluminescence (TR-PL) techniques to study carrier dynamics in MOVPE-grown bulk dilute bismide double heterostructures (DH). Carrier lifetime measurements are crucial to optimizing MOVPE materials growth. We have studied carrier dynamics in GaAsBi QW structures with GaAsP barriers. Carrier lifetimes were measured from GaAsBi DH samples at different stages of post-growth thermal annealing steps. Post-growth annealing yielded significant improvements in carrier lifetimes. Based on this study, single junction solar cells (SJSC) were grown and annealed under a variety of conditions and characterized. The SJSC annealed at 600 – 650 °C exhibited improved response in EQE spectra. In addition, we studied carrier dynamics in MOVPE-grown GaAs-In(Al)GaP DH samples grown on GaAs substrates. The structures were grown on top of a thin AlAs release layer, which allowed epitaxial layers grown on top of the AlAs layer to be removed from the substrate. The GaAs active layers had various doping densities and thicknesses. Our TR-PL results from both pre- and post-ELO processed GaAs-In(Al)GaP DH samples are reported.
High-voltage InGaAs quantum well solar cells have been demonstrated in a thin-film format, utilizing structures that employ advanced band gap engineering to suppress non-radiative recombination and expose the limiting radiative component of the diode current. In particular, multiple InGaAs quantum well structures fabricated via epitaxial lift-off exhibit one-sun open circuit voltages as high as 1.05 V. The dark diode characteristics of these high-voltage III-V photovoltaic devices are compared to the radiative current calculated from the measured external quantum efficiency using a generalized detailed balance model specifically adapted for optically-thin absorber structures. The fitted n=1 component of the diode current is found to match the calculated radiative dark current when assuming negligible photon recycling, suggesting this thin-film multiple quantum well structure is operating close to the radiative limit.
III-V multi-junction solar cells are based on a triple-junction design that consists of an InGaP top junction, a GaAs middle junction, and a bottom junction that employs either a 1eV material grown on the GaAs substrate or InGaAs grown on the Ge substrate. The most promising 1 eV material that is currently under extensive investigation is bulk dilute nitride such as InGaAsN(Sb) lattice matched to GaAs substrates. Both approaches utilizing dilute nitrides and lattice-mismatched InGaAs layers have a potential to achieve high performance triple-junction solar cells. In addition, it will be beneficial for both commercial and space applications if III-V triple-junction solar cells can significantly reduce weight and can be manufactured cost effectively while maintaining high efficiency. The most attractive approach to achieve these goals is to employ full-wafer epitaxial lift off (ELO) technology, which can eliminate the substrate weight and also enable multiple substrate re-usages. For the present study, we employed time-resolved photoluminescence (TR-PL) techniques to study carrier dynamics in MOVPE-grown bulk dilute nitride layers lattice matched to GaAs substrates, where carrier lifetime measurements are crucial in optimizing MOVPE materials growth. We studied carrier dynamics in InGaAsN(Sb) layers with different amounts of N incorporated. Carrier lifetimes were also measured from InGaAsN(Sb) layers at different stages of post-growth thermal annealing steps. Post-growth annealing yielded significant improvements in carrier lifetimes of InGaAsNSb double hetero-structure (DH) samples compared to InGaAsN DH samples possibly due to the surfactant effect of Sb. In addition, we studied carrier dynamics in MOVPE-grown GaAs-InAl(Ga)P layers grown on GaAs substrates. The structures were grown on top of a thin AlAs release layer, which allowed epitaxial layers grown on top of the AlAs layer to be removed from the substrate. The GaAs layers had various doping densities and thicknesses. We present our TR-PL results from both pre- and post-ELO processed GaAs-InAl(Ga)P samples.
High-efficiency, low-cost InGaP/GaAs dual-junction epitaxial liftoff (ELO) solar cells have been fabricated on full
4" GaAs substrates. These dual-junction solar cells exhibited an efficiency of 28.69% at AM1.5D, one-sun
illumination. This is the highest reported efficiency for dual-junction ELO solar cells to date. After application of
antireflection coating, the dual-junction ELO cells also exhibited fill factor >85%, open circuit voltage = 2.37 V, and
short circuit current density = 13 mA/cm2. An external quantum efficiency >85% was measured for both the GaAs
and InGaP sub-cells. An ELO dual-junction solar cell wafer typically weighs less than 1.7 g and has a total
semiconductor thickness <5 μm. Reclaim and reuse of the GaAs substrate after the ELO process has been
successfully demonstrated.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.