Mr. Tuanwei Fu Profile

Tuanwei Fu

at Focuslight Technologies Inc

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Author

Publications (9)

Proceedings Article | 27 November 2023 Paper

High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Jingwei Wang, Yanfang Zheng, Yang Han, Tuanwei Fu, Dong Hou, Xingsheng Liu

Proceedings Volume 12761, 127610N (2023) https://doi.org/10.1117/12.2687224

KEYWORDS: Semiconductor lasers, High power lasers, Laser soldering, Laser bonding, Reliability, Design and modelling, Surgery, Solid state lasers, Scientific research, Packaging

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Proceedings Article | 14 March 2023 Poster + Paper

905nm line-beam laser module with high reliability for automotive LiDAR applications

Yingmin Fan, Hao Zhang, Jiayan Yang, Peng Wang, Wenfang Zhang, Yixiao He, Xiaoyu Tian, Tuanwei Fu, Guopeng Zhang, Chung-en Zah, Xingsheng Liu

Proceedings Volume 12403, 124030T (2023) https://doi.org/10.1117/12.2650886

KEYWORDS: LIDAR, Beam divergence, Reliability, Design and modelling, Laser applications, Light sources, Laser bonding, Edge emitting semiconductor lasers, High power diode lasers, Laser sources

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Proceedings Article | 4 March 2022 Presentation + Paper

High power conductively cooled laser diode array operating under hard pulse condition

ChangXuan Li, Yingmin Fan, Wenwei Li, Ke Yuan, Tuanwei Fu, Jindou Liu, Chung-en Zah, Chun He

Proceedings Volume 11982, 1198203 (2022) https://doi.org/10.1117/12.2609183

KEYWORDS: Heatsinks, Continuous wave operation, Packaging, Optical simulations, Semiconductor lasers, High power lasers, Laser bonding

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Proceedings Article | 4 March 2022 Poster + Presentation + Paper

Development of diode laser stack with high power and long pulse width for medical aesthetic application

Junli Li, Tuanwei Fu, Dong Hou, Jingwei Wang, Yunzhu Chen, Yanfang Zheng, Chungen Zah, Xingsheng Liu

Proceedings Volume 11983, 119830R (2022) https://doi.org/10.1117/12.2608522

KEYWORDS: Semiconductor lasers, Resistance, Convection, Reliability, Laser development, Thermal modeling, Pulsed laser operation, Laser bonding, High power lasers

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Proceedings Article | 9 October 2021 Paper

Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder

Jingwei Wang, Tuanwei Fu, Dong Hou, Lijun Gao, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11891, 118910D (2021) https://doi.org/10.1117/12.2602338

KEYWORDS: Semiconductor lasers, Packaging, High power diode lasers, Near field, Continuous wave operation, Heatsinks

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Proceedings Article | 5 March 2021 Poster + Paper

Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging

Yang Han, Lichen Sun, Tuanwei Fu, Lijun Gao, Yanfang Zheng, Yunzhu Chen, Xiaojuan Zhang, Minna Yan, Sicheng Zhao, Kai Yang, Lei Gao, Chungen Zah, Xingsheng Liu

Proceedings Volume 11668, 116680W (2021) https://doi.org/10.1117/12.2582695

KEYWORDS: Semiconductor lasers, Packaging, Reliability, Laser development, High power diode lasers, Solid state lasers, Resistance, High power lasers, Corrosion, Continuous wave operation

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Proceedings Article | 10 October 2020 Poster + Presentation + Paper

A high-performance annularly stacked laser diode pump for a solid state laser

Junli Li, Lichen Sun, Ming Liu, Yang Han, Tuanwei Fu, Lei Cai, Yanfang Zheng, Minna Yan, Juan Wang, Chunhua Tao, Lijun Gao, Jingwei Wang, Chungen Zah, Xingsheng Liu

Proceedings Volume 11545, 115450J (2020) https://doi.org/10.1117/12.2573534

KEYWORDS: Semiconductor lasers, Laser applications, Packaging, Laser development, Solid state lasers, Manufacturing, Laser systems engineering

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Proceedings Article | 21 February 2020 Presentation + Paper

High power 250W CW conductively cooled diode laser arrays with low-smile

Hongyou Zhang, Pengfei Zhu, Tuanwei Fu, Meiqin Li, Ning Lv, Wenwei Li, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11261, 112610C (2020) https://doi.org/10.1117/12.2540399

KEYWORDS: Packaging, High power lasers, Semiconductor lasers, Continuous wave operation, Laser bonding, Resistance

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Proceedings Article | 4 March 2019 Presentation + Paper

Development of high power annular diode laser array using hard solder

Dong Hou, Lichen Sun, Tuanwei Fu, Li Chen, Xuejie Liang, Lei Cai, Yan Yang, Jingwei Wang, Minna Yan, Chungen Zah, Xingsheng Liu

Proceedings Volume 10899, 108990A (2019) https://doi.org/10.1117/12.2510023

KEYWORDS: Semiconductor lasers, High power lasers, Packaging, Dielectrics, Optical simulations, Gallium arsenide, Copper, Laser development, Structural design, Optical isolators

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Showing 5 of 9 publications

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