Reports the microfabricated nickel clamps for packaging of optical fibers in photonics devices. When the fiber is inserted into the silicon V groove, the microfricated clamps fix it in the V groove. Compared with the traditional silicon V grooves, this approach only involves one additional sputtering, photolithography, and electroplating process. Two single-mode optical fibers were fixed into the silicon V groove by the nickel clamp; the measured insertion loss is lower than 0.1 dB.
A novel, electromagnetically driven variable fiber optic attenuator based on micro-electromechanical system (MEMS) technology is described. The attenuation level is adjusted by changing the microshutter position in the optical path. A new technique, termed "nonsilicon surface micromachining," is used to fabricate the shutter, in which a copper layer was used as the sacrificial layer, and the electroplated FeNi as the structure layer. This scheme provides another way to fabricate the optical microstructure. The optical characteristics of the attenuator are theoretically analyzed, and the result is verified by experiments. The MEMS attenuator has fiber-to-fiber insertion loss less than 3 dB at 1550-nm wavelength, dynamic range greater than 40 dB, 0.2-dB repeatability, and return loss better than 40 dB.
A novel micro-mechanical structure has been put forwarded. It is designed for high precision passive alignment and packaging of optical fibres in optoelectronics devices. The electroplated nickel micro clamp has been fabricated above the silicon V grooves. The clamps, work together with the V groove, fix the optical fibers with high precision for optical alignment when the fibers are inserted into the grooves. The fabrication of the micro clamp involves only one more photolithography and electroplating process. two single mode optical fibers have been fixed into the silicon V-groove by the nickel clamp; the measured insertion loss is lower than 0.1dB. The proposed nickel micro clamp is proved to be a low cost, high performance approach that could be widely applied in passive alignment and packaging of fiber in opto-electronics devices.
A novel micromachined electromagnetic actuated variable optical attenuator is described. The attenuation level is adjusted by changing the lateral distance between two V-groove-aligned single-mode fibers. Based on the waveguide transmission theory, the relationship between the attenuation and the offset is analyzed. The fabrication of the device only enrolls common and well-known semiconductor technologies. The packaged volume of the device is 20×10×5 mm3. According to the experiment results, the insertion loss is less than 1 dB, the polarization dependent loss is less than 0.1 dB, dynamic range is larger than 50 dB, and the driving voltage is less than 5 V. It is proven to be a low-cost, high-performance passive device for future all-optical networks.
An eight-channel variable optical attenuator (VOA) array fabricated by MEMS technology is presented. Based on micro electromagnetic actuation, the attenuation level is adjusted by changing the radial offset between the input/output optical fiber. The relationship between the attenuation and the offset was analyzed based on wave-guide transmission theory. The structure parameter was determined through mechanics and magnetic circuit analysis. The device was fabricated and packaged by micromachining technology. The packaged volume of the device is 80×40×12mm3. According to the experiment results, the insertion loss is less than 1dB, the polarization dependent loss is less than 0.1dB, dynamic range is above 35dB and the driving voltage is less than 5V. It is proved to be a low cost, high performance passive device for future all-optical-networks.
Considering the radius difference among layers and nonlinear temperature distribution inside the fiber coil, a simple, accurate model for the quantitative analysis of the thermal induced nonreciprocity in sagnac interferometer has been put forward and confirmed by experimental results. Based on the model, a novel approach to reduce the Shupe effect by 60% has been figured out.
Power management is an increasingly concerned issue in all-optical network, where the continuous adjustment of the transmitted power is required. In this paper, the diffractive optical propagation inside a magnetic actuated, surface micromachined variable optical attenuator has been modeled and characterized. The modeling of the diffractive optical propagation is based on a gaussian beam approximation to the fiber mode, a calculation of the free space diffraction past a square aperture based on the Fresnel-Kirkhoff diffraction integral, and the mode-overlap integral between the diffracted beam and the fiber mode. The fabrication of the attenuator is based on the nonsilicon surface micromachine technology. The experimental data is in good agreement with the theoretical calculation result. Based on the work, a variable optical attenuator (VOA) has been successfully developed.
Power management is an increasingly concerned issue in Dense Wavelength Division Multiplexed (DWDM) network. It poses strict comprehensive requirements, such as electronic controllability, cost and volume, etc, on the Variable Optical Attenuator (VOA). The characteristics of MEMS technology make it to be one of the most prospective candidates to meet these requirements. This paper consists of three parts. The first part is a description of VOA application in all-optic network. In the light of these aspects, the main requirements for VOA devices are quantitatively identified. In the second part, the current situation of research on MEMS based VOA is presented extensively. Finally, several novel applications of MEMS based VOA in all optic networks are illustrated. It illustrates the premise that MEMS VOA can bring added capability or new functionality to optical designs and increase the incentive to explore their potential in lightwave subsystems. Considering the attractive market volume in 2008, MEMS based VOA seems to be one of the most prospective candidates for the commercialization of optical MEMS technology.
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