In this works, we have demonstrated a VOA integrated with mPDs, based on silica-on-silicon PLC and flip-chip bonding technologies. The suspended ridge structure was applied to reduce the power consumption. It achieves the attenuation of 30dB in open loop operation with the power consumption of below 30W. We have applied two-step flipchip bonding method using passive alignment to perform high density multi-chip integration on a VOA with eutectic AuSn solder bumps. The average bonding strength of the two-step flip-chip bonding method was about 90gf.
In this study, we proposed and fabricated optical sensor module integrated onto optical-electrical printed circuit board (PCB) for gas detection based on polymer waveguide with tin oxide thin film. Their potential application as gas sensors are confirmed through computational simulation using the two dimensional finite-difference time-domain method (2DFDTD). Optical-electrical PCB was integrated into vertical cavity surface emitting laser (VCSEL), photodiode and polymeric sensing device was fabricated by the nano-imprint lithography technique. SnO2 thin film of 100nm thickness was placed on the surface of core layer exposed by removing the specific area of the upper cladding layer of 300 μm length and 50 μm width. The performance of the device was measured experimentally. Initial study on the sensor performance for carbon monoxide gas detection indicated good sensitivity.
We proposed the photonic crystal coupled surface plasmon resonance sensors using gold nano-structure to enhance the
sensitivity of an SPR sensor. The proposed configuration with the photonic crystal structure is Au(Photonic
crystal)/Au/Ag/Cr/Glass. The 20 nm silver film and the 20 nm gold film are layered on the glass substrate. Then, the
dot-like gold photonic crystal structures with a period pitch are patterned on the Au/Ag/Cr/Glass structure. The
reflectance and the optical-mode propagations as a function of incident angle are calculated using the three-dimensional
finite-difference time-domain method. Under this resonance condition, the incident light is highly absorbed and loses a
fair amount of its energy, which results in a dip in the intensity profile of the reflected light. The optimum resonance
angle of 44.5 degrees is obtained in the 75-nm-radius Au photonics crystal structure with a period of 300 nm.
We integrate transmitting and receiving parallel optical subassemblies (POSAs) that are suitable for high-speed and parallel optical modules between optical components by using a simple and high-accuracy alignment technique. Characteristics of the proposed POSAs include a low coupling loss of 0.75 dB, a wide bandwidth for 10 Gbits/s transmission per channel, and low optical and electrical crosstalk of less than 30 dB. As a result, a data transmission rate of 10 Gbits/s×12 channels is well demonstrated with clean eye diagrams.
We present a new configuration for a polymer wavelength division multiplexing (WDM) filter based on multimode interference. We developed a hybrid integrated subassembly module for 1.31- and 1.55-µm bidirectional operation. Active devices including a laser diode with a monitoring photodiode and a receiving photodiode were integrated on a silicon optical bench (SiOB) platform using a flip-chip bonding technique. A polymer WDM filter chip made of polymethylmethacrylate was fabricated using a hot embossing technique. We then investigated the optical performance of the transmitter and receiver subassembly module using a SiOB platform. This hybrid integrated subassembly module exhibited bidirectional 2.5-Gbit/s signal modulation with a minimum sensitivity of −20.5 dBm at a bit error rate of 10−10 and an optical crosstalk of −35 dB.
We propose a simple method to self-compensate temperature which can affect the sensitivity of palladium-based
hydrogen gas sensor. When a long-period fiber grating is fabricated in a double cladding fiber, the fundamental core
mode is coupled to the inner cladding mode as well as the outer cladding mode. Since the inner cladding mode is
insensitive to the external contact, it is independent to the thin palladium layer coated out of cladding surface. Thus, the
spectrum corresponding to outer cladding modes reflects the reaction between hydrogen and palladium while that of the
inner cladding mode indicates the ambient temperature only.
A rigid flexible optical electrical printed circuit board (RFOE-PCB) with both electrical layers and an optical layer was fabricated using a conventional PCB manufacture process. The RFOE-PCB is applicable to fold-type mobile devices such as mobile phones and laptop computers. The RFOE-PCB was designed to be embedded with a flexible 45-deg-ended optical waveguide, which was made using a polymeric material. The precise lamination between an electrical layer and an optical layer was achieved by a passive alignment method. We carried out the repetitive folding test and an environment test for physical and optical reliability suitable for mobile devices. Data transmission of 2.5 Gb/s was demonstrated with a clear eye diagram using the fabricated RFOE-PCB.
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