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17 March 2023 Direct laser printing of functional micro-electronics
Liang Yang, Hongrong Hu, Alexander Scholz, Florian Feist, Gabriel Cadilha Marques, Niklas Maximilian Bojanowski, Eva Blasco, Jasmin Aghassi-Hagmann, Martin Wegener
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Proceedings Volume PC12412, Laser 3D Manufacturing X; PC124120J (2023) https://doi.org/10.1117/12.2648197
Event: SPIE LASE, 2023, San Francisco, California, United States
Abstract
We introduce direct laser printing of functional electronics composed of conductive (Pt and Ag) and semiconducting (ZnO) materials with minimum feature sizes well below 1 µm. Our proof-of-principle experiments include diodes, transistors, memristors, and memristor-crossbar circuits forming a physically unclonable function. We emphasize that no sintering or other post-processing steps are necessary; the focused laser performs the lateral/vertical structuring as well as the material sintering. We expect that our laser-printing technique can be extended to many other semiconductor materials. Moreover, it can be combined with ink-jet printing. Therefore, laser printing provides a promising avenue for digitally printed electronics.
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Liang Yang, Hongrong Hu, Alexander Scholz, Florian Feist, Gabriel Cadilha Marques, Niklas Maximilian Bojanowski, Eva Blasco, Jasmin Aghassi-Hagmann, and Martin Wegener "Direct laser printing of functional micro-electronics", Proc. SPIE PC12412, Laser 3D Manufacturing X, PC124120J (17 March 2023); https://doi.org/10.1117/12.2648197
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KEYWORDS
Nonimpact printing
Printing
Inkjet technology
Electronics
Zinc oxide
Electronic components
Metals
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