Paper
6 August 1980 Multiplexed Intrinsic Detector Arrays With Signal Processing (MIDASP) Program Development Of Hybrid Technology For Advanced Scanning Systems
M. Gurnee, R. Rawe, M. Dries
Author Affiliations +
Proceedings Volume 0225, Infrared Image Sensor Technology; (1980) https://doi.org/10.1117/12.958699
Event: 1980 Technical Symposium East, 1980, Washington, D.C., United States
Abstract
The MIDASP program has been aimed at development of the fundamental technology necessary for fabrication of hybrid (Hg,Cd)Te detector/silicon signal processor focal planes for second generation FL 1R systems. Effort has been concentrated in four areas: 1) 3-5 micrometer (Hg,Cd)Te photodiodes, 2) detector/CCD mechanical inter-connect, 3) detector/CCD electrical coupling, and 4) fabrication and evaluation of small focal plane structures. Detector/CCDs with several 8-TD1 channels multiplexed to a single output have been successfully demonstrated, with an overall D* of up to 1x1014 cm-Hz1/2/W.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Gurnee, R. Rawe, and M. Dries "Multiplexed Intrinsic Detector Arrays With Signal Processing (MIDASP) Program Development Of Hybrid Technology For Advanced Scanning Systems", Proc. SPIE 0225, Infrared Image Sensor Technology, (6 August 1980); https://doi.org/10.1117/12.958699
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KEYWORDS
Sensors

Charge-coupled devices

CCD image sensors

Signal processing

Signal detection

Detector development

Diodes

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