Paper
13 September 1982 Reactive Sputter Etching And Its Applications
Sasson Somekh
Author Affiliations +
Abstract
The requirements for high-fidelity, anisotropic etching are discussed. A brief discussion on the various dry etch techniques available is followed by a description of a batch reactive sputter etch system that fulfills all patterning requirements. Examples of results obtained with this system are given and demonstrated with SEM photographs.
© (1982) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sasson Somekh "Reactive Sputter Etching And Its Applications", Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); https://doi.org/10.1117/12.933574
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Etching

Ions

Anisotropic etching

Silicon

Optical lithography

Aluminum

Dry etching

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