Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques

Robert R. Alien; Myron Cagan; Marti Foster; Talat Hasan

doi:10.1117/12.941899

29 June 1984 Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques

Robert R. Alien, Myron Cagan, Marti Foster, Talat Hasan

Proceedings Volume 0470, Optical Microlithography III: Technology for the Next Decade; (1984) https://doi.org/10.1117/12.941899
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

Automatic alignment has been offered by most manufacturers of alignment tools in recent years, and is regarded as essential in acheiving the overlay accuracy required to produce the current generation of fine-line integrated circuits. However, problems associated with the automatic alignment technologies themselves can offset the gains achieved and can, in worst case, actually degrade overall registration performance. Two important problems which must be overcome are: Autoalignment offsets which can cause alignment accuracy to deviate by more than a micron, even though precision is quarter micron or better. 2. Process-dependent variations- causing changes in the topographical and optical characteristics of the alignment keys which can change or degrade the signal produced by the key.

Citation Download Citation

Robert R. Alien, Myron Cagan, Marti Foster, and Talat Hasan "Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques", Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); https://doi.org/10.1117/12.941899

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