Photoelastic Measurements Of Residual Stresses For NDE

Alex S. Redner

doi:10.1117/12.941652

17 February 1987 Photoelastic Measurements Of Residual Stresses For NDE

Alex S. Redner

Proceedings Volume 0814, Photomechanics and Speckle Metrology; (1987) https://doi.org/10.1117/12.941652
Event: 31st Annual Technical Symposium on Optical and Optoelectronic Applied Sciences and Engineering, 1987, San Diego, CA, United States

Abstract

Photoelastic measurements of residual strains are used extensively in the QC and inspection of transparent materials. A new method of measurements, based on Spectral Contents Analysis, is described in this paper. The method uses a personal computer for photoelastic data acquisition, eliminating personal skill and subjectivity. The new tool should make the measurements of residual strains for QC simpler and more reliable.

Citation Download Citation

Alex S. Redner "Photoelastic Measurements Of Residual Stresses For NDE", Proc. SPIE 0814, Photomechanics and Speckle Metrology, (17 February 1987); https://doi.org/10.1117/12.941652

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