Open Access Paper
21 November 2017 Non destructive examination of interface of molecular assembly
Guy Perez, Isaline Richard, Jean-Claude Lecomte
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Proceedings Volume 10569, International Conference on Space Optics — ICSO 2000; 105691P (2017) https://doi.org/10.1117/12.2307920
Event: International Conference on Space Optics 2000, 2000, Toulouse Labège, France
Abstract
Molecular assembly interfaces can be characterised by mechanical testing and/or the interaction between waves and the interface. The disadvantage of the mechanical approach is that new defects may be produced at the interface, or existing defects may be destroyed.

Using the interaction between waves and the interface is a non-destructive approach. But what kind of waves should be used? Electromagnetic waves in the visible range depend on wave attenuation in the material, infrared waves also depend on the thickness and X-ray waves have a too short a wave length to detect interface defects. In this article, the use of acoustic waves is proposed for non-destructive examination of molecular assembly interfaces.

Acoustic wave propagation is very sensitive to variations in interface characteristics depending on whether the waves are reflected or transmitted. To improve the sensitivity and resolution of this technique, small wave lengths have been used with a scanning acoustic microscope (S.A.M.) with a band width from 1MHz to 400 MHz. After a short description of the principle of the method, results are given for different types of components. Different applications of acoustic microscopy are proposed for non-destructive examination of interfaces and defect detection in materials.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Guy Perez, Isaline Richard, and Jean-Claude Lecomte "Non destructive examination of interface of molecular assembly", Proc. SPIE 10569, International Conference on Space Optics — ICSO 2000, 105691P (21 November 2017); https://doi.org/10.1117/12.2307920
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KEYWORDS
Interfaces

Acoustics

Molecular assembly

Microscopy

Transducers

Defect detection

Nondestructive evaluation

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