Development of A Hermetically Packaged 13µm Pixel Pitch 6000-Element InGaAs Linear Array

Kai Song; Jih-Fen Lei; Anders Peterson; Henry Yuan; Jongwoo Kim; Joe Kimchi; Vincent Douence; Brian Starr; Venkataraman Sundareswaran; James W. Beletic

doi:10.1117/12.2305374

14 May 2018 Development of a hermetically packaged 13μm pixel pitch 6000-element InGaAs linear array

Kai Song, Jih-Fen Lei, Anders Peterson, Henry Yuan, Jongwoo Kim, Joe Kimchi, Vincent Douence, Brian Starr, Venkataraman Sundareswaran, James W. Beletic

Author Affiliations +

Proceedings Volume 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V; 106560K (2018) https://doi.org/10.1117/12.2305374
Event: SPIE Commercial + Scientific Sensing and Imaging, 2018, Orlando, FL, United States

Abstract

In this paper, we present the test results of a flight-grade 13μm pixel pitch 6000-element 1.7μm InGaAs linear array in a hermetic package, designed and developed for space remote sensing and imaging applications. The array consists of a single 13μm pixel pitch 6000-element InGaAs linear array and a custom single digital 2.0 Mecapacitance trans-impedance amplifier (CTIA) readout integrated circuit (ROIC) with four gains. We have achieved greater than 80% peak quantum efficiency and higher than 1100 signal-to-noise ratio (SNR) at 90% well fill. The focal plane array is in a vacuum hermatically sealed package with an anti-reflective (AR)-coated Sapphire window and 29 pins, including four for low voltage differential signaling (LVDS) outputs.

Conference Presentation

Citation Download Citation

Kai Song, Jih-Fen Lei, Anders Peterson, Henry Yuan, Jongwoo Kim, Joe Kimchi, Vincent Douence, Brian Starr, Venkataraman Sundareswaran, and James W. Beletic "Development of a hermetically packaged 13μm pixel pitch 6000-element InGaAs linear array", Proc. SPIE 10656, Image Sensing Technologies: Materials, Devices, Systems, and Applications V, 106560K (14 May 2018); https://doi.org/10.1117/12.2305374

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