Paper
8 August 1989 Materials And Technologies For Microstructure Engineering
R. L. Smith, S. D. Collins
Author Affiliations +
Abstract
The fabrication of microstructures for sensing and actuating has evolved in the last few years to include special technologies and materials, not commonly used in the integrated circuit industry, but which are, at least to some degree, compatible with those planar structures. Microsensors and actuators are now more frequently being constructed in the third dimension to enable mechanical motion, or to incorporate packaging components. This paper presents some of the materials and technologies for microstructure engineering which are being developed and implemented in current microsensor designs.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. L. Smith and S. D. Collins "Materials And Technologies For Microstructure Engineering", Proc. SPIE 1068, Catheter-Based Sensing and Imaging Technology, (8 August 1989); https://doi.org/10.1117/12.952151
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KEYWORDS
Silicon

Etching

Thin films

Silicon films

Oxides

Glasses

Semiconducting wafers

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