Paper
1 April 2019 High frequency guided wave defect imaging in monocrystalline silicon wafers
Author Affiliations +
Abstract
Micro-cracks can be induced in thin monocrystalline silicon wafers during the manufacture of solar panels. High frequency guided waves allow for the monitoring of wafers and characterization of defects. Selective excitation of the first anti-symmetric A0 guided wave mode was achieved experimentally using a custom-made wedge transducer. The Lamb wave scattered field in the vicinity of artificial defects was measured using a noncontact laser interferometer. The surface extent of the shallow defects varying in size from 30 μm to 100 μm was characterized using an optical microscope. The characteristics of the scattered wave field were correlated to the defect size and the detection sensitivity was discussed.
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Mathieu Simon, Bernard Masserey, Jean-Luc Robyr, and Paul Fromme "High frequency guided wave defect imaging in monocrystalline silicon wafers ", Proc. SPIE 10972, Health Monitoring of Structural and Biological Systems XIII, 1097206 (1 April 2019); https://doi.org/10.1117/12.2513675
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KEYWORDS
Semiconducting wafers

Silicon

Ultrasonics

Transducers

Wave propagation

Scattering

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