Research on picosecond laser processing technology of ceramic materials involving incident angle

Heng Wang; Xiaoxiao Chen; Wenwu Zhang

doi:10.1117/12.2538899

19 November 2019 Research on picosecond laser processing technology of ceramic materials involving incident angle

Heng Wang, Xiaoxiao Chen, Wenwu Zhang

Proceedings Volume 11183, Advanced Laser Processing and Manufacturing III; 111830R (2019) https://doi.org/10.1117/12.2538899
Event: SPIE/COS Photonics Asia, 2019, Hangzhou, China

Abstract

In order to realize the laser precision machining of ceramics, the influence of some basic machining parameters (power, scanning speed, scan path spacing, and incidence angle) on the machining effect was studied. The experimental results show that the selection of reasonable processing parameters can obtain better processing quality and processing efficiency. The material removal rate firstly increases, and then decreases with the increment of the incident angle, which indicates that the incident angle has a great influence on the utilization of laser energy. In addition, the machined surface roughness is better after machining at high scanning speed and low power.

Citation Download Citation

Heng Wang, Xiaoxiao Chen, and Wenwu Zhang "Research on picosecond laser processing technology of ceramic materials involving incident angle", Proc. SPIE 11183, Advanced Laser Processing and Manufacturing III, 111830R (19 November 2019); https://doi.org/10.1117/12.2538899

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