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9 March 2020 High-speed silicon photonic optical interconnects for cryogenic readout (Conference Presentation)
Steven B. Estrella, Takako Hirokawa, Aaron Maharry, Daniel S. Renner, Clint L. Schow
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Proceedings Volume 11286, Optical Interconnects XX; 112860B (2020) https://doi.org/10.1117/12.2546635
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Silicon (Si) photonics is well-positioned to provide high-speed and low-cost optical interconnects. The extraction of data from cryogenically cooled integrated circuits (ICs) has become of great interest for low-power data readout. Utilizing wavelength division multiplexing (WDM), a high capacity optical interconnect can be realized using remoted Si photonic based ring resonator modulators (RRMs). Results include operation up to 20 Gbps and BER < 1E-12 using a 2 Vpp signal, consuming < 100 fJ/bit in the cold environment. Lastly, Si photonic RRM device and interconnect optimizations for operation at temperatures ≤ 77 K will be presented.
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Steven B. Estrella, Takako Hirokawa, Aaron Maharry, Daniel S. Renner, and Clint L. Schow "High-speed silicon photonic optical interconnects for cryogenic readout (Conference Presentation)", Proc. SPIE 11286, Optical Interconnects XX, 112860B (9 March 2020); https://doi.org/10.1117/12.2546635
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KEYWORDS
Optical interconnects
Silicon photonics
Cryogenics
Silicon
Photonics
Wavelength division multiplexing
Receivers
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