Multi-beam processing as a method for efficient micromachining with pico second mJ level laser systems

Danijela Rostohar

doi:10.1117/12.2593540

11 March 2021 Multi-beam processing as a method for efficient micromachining with pico second mJ level laser systems

Danijela Rostohar

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Proceedings Volume 11768, SPIE Photonics West Industry Events; 117680K (2021) https://doi.org/10.1117/12.2593540
Event: SPIE Photonics West Industry, 2021, Online Only

Abstract

When applying picosecond laser pulses of the order of several mJ pulse energy, the goal is to deliver the pulses effectively to the surface. HiLASE have development novel diode pumped thin-disk laser systems which are used for high speed drilling (700 holes simultaneously) and high speed surface structuring (several cm2 per second). Different methods of multi-beam processing will be presented.

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Danijela Rostohar "Multi-beam processing as a method for efficient micromachining with pico second mJ level laser systems", Proc. SPIE 11768, SPIE Photonics West Industry Events, 117680K (11 March 2021); https://doi.org/10.1117/12.2593540

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