Optical metrology of 3D thin film conformality by LHAR chip assisted method

Mikko Utriainen; Kimmo Saastamoinen; Heikki Rekola; Oili M. E. Ylivaara; Riikka L. Puurunen; Pasi Hyttinen

doi:10.1117/12.2609643

5 March 2022 Optical metrology of 3D thin film conformality by LHAR chip assisted method

Mikko Utriainen, Kimmo Saastamoinen, Heikki Rekola, Oili M. E. Ylivaara, Riikka L. Puurunen, Pasi Hyttinen

Proceedings Volume 12008, Photonic Instrumentation Engineering IX; 120080D (2022) https://doi.org/10.1117/12.2609643
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.

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Citation Download Citation

Mikko Utriainen, Kimmo Saastamoinen, Heikki Rekola, Oili M. E. Ylivaara, Riikka L. Puurunen, and Pasi Hyttinen "Optical metrology of 3D thin film conformality by LHAR chip assisted method", Proc. SPIE 12008, Photonic Instrumentation Engineering IX, 120080D (5 March 2022); https://doi.org/10.1117/12.2609643

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