A cost-cutting solution for coherent optical device packaging: wafer-level combine test of optical and analog chips

Luluzi Lu; Quan Cao; Shichao Zhu; Sheng Yu; Xun Lei

doi:10.1117/12.2604509

24 November 2021 A cost-cutting solution for coherent optical device packaging: wafer-level combine test of optical and analog chips

Luluzi Lu, Quan Cao, Shichao Zhu, Sheng Yu, Xun Lei

Author Affiliations +

Proceedings Volume 12066, AOPC 2021: Micro-optics and MOEMS; 120660S (2021) https://doi.org/10.1117/12.2604509
Event: Applied Optics and Photonics China 2021, 2021, Beijing, China

Abstract

The wafer-level co-test of optical and analog chips is demonstrated to be cost-cutting solution for coherent optical device packaging. The extinction ratio test and the phase error test are illustrated for example.

Citation Download Citation

Luluzi Lu, Quan Cao, Shichao Zhu, Sheng Yu, and Xun Lei "A cost-cutting solution for coherent optical device packaging: wafer-level combine test of optical and analog chips", Proc. SPIE 12066, AOPC 2021: Micro-optics and MOEMS, 120660S (24 November 2021); https://doi.org/10.1117/12.2604509

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