Anti-vibration design of Surface Mount Devices in the aerospace electronic equipment

Feng Dai; Min Shi

doi:10.1117/12.2638659

20 September 2022 Anti-vibration design of Surface Mount Devices in the aerospace electronic equipment

Feng Dai, Min Shi

Proceedings Volume 12261, International Conference on Mechanical Design and Simulation (MDS 2022); 122611W (2022) https://doi.org/10.1117/12.2638659
Event: Second International Conference on Mechanical Design and Simulation (MDS 2022), 2022, Wuhan, China

Abstract

Surface Mount Devices (SMD) greatly improve the product integration and the chip package area ratio. On the other hand, due to the large number of pins and the very small volume of solder joints, it is easy to crack solder joints in the vibration environment of spacecraft launching, which causes the strength reliability problem. The bending stiffness of SMDs is compared with that of printed circuit boards (PCB) and is analyzed by using the bending stiffness theory of plate in this paper. The key factors, which affect the vibration reliability of SMD solder joints, are obtained. A PCB stiffening rib design method to improve the vibration reliability of SMD is given from the aspect of the structural system design of the electronic equipment. By using the finite element method (FEM), it is verified that this method can greatly reduce the relative displacement between SMDs and PCBs, and effectively improve the anti-vibration characteristics of SMD solder joints. The method also has the advantages of reducing the overall size of electronic equipment and facilitating the application of heat sink to the heating components, and has been widely used in various types of aerospace electronic equipment.

Citation Download Citation

Feng Dai and Min Shi "Anti-vibration design of Surface Mount Devices in the aerospace electronic equipment", Proc. SPIE 12261, International Conference on Mechanical Design and Simulation (MDS 2022), 122611W (20 September 2022); https://doi.org/10.1117/12.2638659

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