Presentation + Paper
16 December 2022 Ultrashort pulse laser drilling of the ceramic substrate
Author Affiliations +
Abstract
Electronic ceramic substrates have been widely used in various markets, which include the automotive industry, electronics, aviation, and sensor due to their good thermal conductivity and thermal stability. The holes in ceramic substrates are very important for their application, many techniques are studied to drill holes of different sizes. This research presents the results of UV ultrashort pulse laser drilling of ceramic substrates with different laser parameters. Normally, the ultrashort pulse laser can be used to process materials due to its less heat-affected zone, so the heat-affected zone of the hole is also observed around the laser-drilled holes.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hao Wang, Yutao Wang, Li Wang, Qingchuan Guo, Kun Liu, and Gongxu Luo "Ultrashort pulse laser drilling of the ceramic substrate", Proc. SPIE 12312, Advanced Laser Processing and Manufacturing VI, 1231203 (16 December 2022); https://doi.org/10.1117/12.2641518
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KEYWORDS
Laser drilling

Ceramics

Picosecond phenomena

Laser cutting

Pulsed laser operation

Ultrafast phenomena

Laser processing

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