GHz burst mode processing: ablation, LIPSS, TPP, LIPAA

Koji Sugioka; Kotaro Obata; Shota Kawabata

doi:10.1117/12.2648534

17 March 2023 GHz burst mode processing: ablation, LIPSS, TPP, LIPAA

Koji Sugioka, Kotaro Obata, Shota Kawabata

Proceedings Volume 12409, Laser-based Micro- and Nanoprocessing XVII; 124090P (2023) https://doi.org/10.1117/12.2648534
Event: SPIE LASE, 2023, San Francisco, California, United States

Abstract

Femtosecond laser pulses with GHz burst mode, which consists of a series of femtosecond laser pulse trains with a pulse interval of several hundred ps is expected to achieve high-efficiency and high-quality materials processing that cannot be performed by the conventional irradiation scheme. In this paper, we show the results of GHz burst mode ablation of silicon and copper. We further extend the GHz burst mode to surface nanostructuring for formation of novel two-dimenional laser-induced periodic surface structures (LIPSS), two-photon plolymerization (TPP) for improvement of fabrication resolution, and laser-induced plasma-assisted ablation (LIPAA) for high-quality microfabrication of transparent materials.

Conference Presentation

Citation Download Citation

Koji Sugioka, Kotaro Obata, and Shota Kawabata "GHz burst mode processing: ablation, LIPSS, TPP, LIPAA", Proc. SPIE 12409, Laser-based Micro- and Nanoprocessing XVII, 124090P (17 March 2023); https://doi.org/10.1117/12.2648534

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