THz electronics for sensing and communication applications

Chun-Hsing Li; Wei-Zhe Su; Yu-Kai Chen

doi:10.1117/12.2680824

4 October 2023 THz electronics for sensing and communication applications

Chun-Hsing Li, Wei-Zhe Su, Yu-Kai Chen

Proceedings Volume 12683, Terahertz Emitters, Receivers, and Applications XIV; 1268308 (2023) https://doi.org/10.1117/12.2680824
Event: SPIE Optical Engineering + Applications, 2023, San Diego, California, United States

Abstract

The challenges of THz electronics in CMOS technologies for THz sensing and communication applications are addressed in this work, focusing on device-level design to system integration approaches. State-of-the-art THz circuits, components, design methodologies, and system demonstration were proposed, including a 40-nm-CMOS transistor layout design using an electromagnetic modeling approach, a 340-GHz higher-order-mode high-gain dielectric resonator antenna, a 340-GHz CMOS heterodyne receiver, a 340-GHz heterogeneously-integrated THz transmitter with 2×25 antennas, a THz heterogeneously-integrated platform with low-loss single-band, dual-band, and broadband interconnects, and a THz transmissive imaging system with a spatial resolution of 1.4 mm at 336 GHz.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Chun-Hsing Li, Wei-Zhe Su, and Yu-Kai Chen "THz electronics for sensing and communication applications", Proc. SPIE 12683, Terahertz Emitters, Receivers, and Applications XIV, 1268308 (4 October 2023); https://doi.org/10.1117/12.2680824

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