Rounded-corner aware OPC for convergency and lithography performance improving

Ruihua Liu; Fu Li; Chunlong Yu; Jingjing Fan; Yu Mu; Song Sun; Chong Wang; Jiangliu Shi; Qingchen Cao

doi:10.1117/12.2686228

21 November 2023 Rounded-corner aware OPC for convergency and lithography performance improving

Ruihua Liu, Fu Li, Chunlong Yu, Jingjing Fan, Yu Mu, Song Sun, Chong Wang, Jiangliu Shi, Qingchen Cao

Proceedings Volume 12751, Photomask Technology 2023; 1275115 (2023) https://doi.org/10.1117/12.2686228
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Conference Poster

Abstract

Mask corner rounding refers to the unintentional rounding deviation of sharp corners or edges during the mask making process, that is caused by the inherent limitations of the e-beam exposure system, such as beam blur, proximity effects, and the resist exposure process. It can have significant consequences on the lithography of chip manufacturing. This article compares the mask corner rounding behavior under different electron beam sizes and presents a novel Optical Proximity Correction (OPC) approach that incorporates mask corner rounding for various dimensional rectangular shapes, named Rounded Corner Aware OPC (RC-OPC). Contrasting with traditional OPC that rely on a single value for simulating mask corner rounding, this innovative OPC approach delivers substantial advantages including increased accuracy, exceptional lithographic performance, and better pattern fidelity, leading to a more dependable and robust process.

Citation Download Citation

Ruihua Liu, Fu Li, Chunlong Yu, Jingjing Fan, Yu Mu, Song Sun, Chong Wang, Jiangliu Shi, and Qingchen Cao "Rounded-corner aware OPC for convergency and lithography performance improving", Proc. SPIE 12751, Photomask Technology 2023, 1275115 (21 November 2023); https://doi.org/10.1117/12.2686228

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