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12 March 2024 GHz burst pumped third-harmonic pulses for precise microfabrication of silicon
Haruyuki Sakurai, Kuniaki Konishi
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Proceedings Volume 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX; 128720D (2024) https://doi.org/10.1117/12.3008827
Event: SPIE LASE, 2024, San Francisco, California, United States
Abstract
There is increased interest in ultrashort GHz burst pulses for uses in precise laser microfabrication. Whereas previous works have focused on GHz burst processing at fundamental wavelengths, here we present results for processing with the third harmonics generated from GHz burst pulses. We find that with these pulses, we are able to achieve high-quality microfabrication of silicon with markedly less debris than with traditional non-burst pulses. We then demonstrated debris-free milling of a silicon micro-hemisphere to show how these conditions are particularly favorable for feedback monitored fabrication applications. Such results show the benefits of GHz-burst-pumped third harmonic machining by commercially available laser sources.
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(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Haruyuki Sakurai and Kuniaki Konishi "GHz burst pumped third-harmonic pulses for precise microfabrication of silicon", Proc. SPIE 12872, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX, 128720D (12 March 2024); https://doi.org/10.1117/12.3008827
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KEYWORDS
Silicon
Microfabrication
Ablation
Laser ablation
Laser processing
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