Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 12915, including the Title Page, Copyright information, Table of Contents, and Conference Committee.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

The papers reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in Photomask Japan 2023: XXIX Symposium on Photomask and Next-Generation Lithography Mask Technology, edited by Yosuke Kojima, Proc. of SPIE 12915, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510670907

ISBN: 9781510670914 (electronic)

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Copyright © 2023 Society of Photo-Optical Instrumentation Engineers (SPIE).

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  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Conference Committee

Symposium Chair

  • Takeo Watanabe, University of Hyogo (Japan)

Symposium Vice Chair

  • Masaru Nakagawa, Tohoku University (Japan)

Advisory Committee Chair

  • Tadahiro Takigawa, ALITECS Corporation (Japan)

Advisory Committee Members

  • Naoya Hayashi, DNP, Honorary Fellow (Japan)

  • Morihisa Hoga, NAMTEC Co., Ltd. (Japan)

  • Toshiyuki Horiuchi, Tokyo Denki University (Japan)

  • Hiroaki Morimoto (Japan)

  • Masato Shibuya, Tokyo Polytechnic University (Japan)

  • Kazuyuki Suko, Dai Nippon Printing Co., Ltd. (Japan)

  • Yoshio Tanaka, D2S, Inc. (Japan)

  • Nobuyuki Yoshioka, Dai Nippon Printing Co., Ltd. (Japan)

Organizing Committee Chair

  • Takeo Watanabe, University of Hyogo (Japan)

Organizing Committee Vice Chair

  • Masaru Nakagawa, Tohoku University (Japan)

Organizing Committee Members

  • Uwe Behringer, UBC Microelectronics (Germany)

  • Emily Gallagher, imec (Belgium)

  • Brian Grenon, Grenon Consulting, Inc. (United States)

  • Hideaki Hamada, HTL Co. Japan Ltd. (Japan)

  • Masahiro Hashimoto, HOYA Corporation (Japan)

  • Eiichi Hoshino, Nikon Corporation (Japan)

  • Koji Ichimura, Dai Nippon Printing Co., Ltd. (Japan)

  • Soichi Inoue, Kioxia Corporation (Japan)

  • Kokoro Kato, Synopsys, Inc. (Japan)

  • Yosuke Kojima, Toppan Photomask Co., Ltd. (Japan)

  • Warren Montgomery, EMD Electronics (United States)

  • Noriaki Nakayamada, NuFlare Technology, Inc. (Japan)

  • Keita Shogase, SEMI Japan (Japan)

  • Kiyohito Yamamoto, Canon Inc. (Japan)

Organizing Committee Auditors

  • Fumio Aramaki, Hitachi High-Tech Corporation (Japan)

  • Yoji Tonooka, Toppan Inc. (Japan)

Program Committee Chair

  • Yosuke Kojima, Toppan Photomask Co., Ltd. (Japan)

Program Committee Vice Chairs

  • Tetsuo Harada, University of Hyogo (Japan)

  • Masaaki Koyama, Sony Semiconductor Manufacturing Corporation (Japan)

  • Hiroshi Nakata, Dai Nippon Printing Co., Ltd. (Japan)

Program Committee Members

  • Akihiko Ando, Kioxia Corporation (Japan)

  • Jin Choi, Samsung Electronics Co., Ltd. (Korea, Republic of)

  • Thomas Faure, GlobalFoundries Inc. (United States)

  • Thiago Figueiro, Aselta Nanographics (France)

  • Kenji Go, Mycronic Technologies Corporation (Japan)

  • Terumasa Hirano, HOYA Corporation (Japan)

  • Sanehiko Hoshi, D2S K.K. (Japan)

  • Koji Ichimura, Dai Nippon Printing Co., Ltd. (Japan)

  • Bryan Kasprowicz, HOYA Corporation (United States)

  • Kokoro Kato, Synopsys, Inc. (Japan)

  • Yusuke Kawano, Renesas Electronics Corporation (Japan)

  • Byung-Gook Kim, ESOL, Inc. (Korea)

  • Hiroyuki Miyashita, Dai Nippon Printing Co., Ltd. (Japan)

  • Noriaki Nakayamada, NuFlare Technology, Inc. (Japan)

  • Dong-Seok Nam, ASML US (United States)

  • Yuhei Nitta, Nikon Corporation (Japan)

  • Nobuhiro Okai, Hitachi, Ltd. (Japan)

  • Thomas Scheruebl, Carl Zeiss SMT GmbH (Germany)

  • Kazunori Seki, Toppan Photomask Co., Ltd. (Japan)

  • Tsutomu Shoki, HOYA Corporation (Japan)

  • Yasunari Sohda, University of Tsukuba (Japan)

  • Yasuko Tabata, Tower Partners Semiconductor Co., Ltd. (Japan)

  • Tetsuro Wakatsuki, JEOL Ltd. (Japan)

  • Masami Yonekawa, Canon Inc. (Japan)

  • Guojing Zhang, Intel Corporation (United States)

Steering Committee Chair

  • Kokoro Kato, Synopsys, Inc. (Japan)

Steering Committee Vice Chairs

  • Soichi Inoue, Kioxia Corporation (Japan)

  • Teruaki Noguchi, JEOL Ltd. (Japan)

Steering Committee Members

  • Yumiko Amano, Renesas Electronics Corporation (Japan)

  • Akihiko Ando, Kioxia Corporation (Japan)

  • Hajime Aoyama, Nikon Corporation (Japan)

  • Kenji Go, Mycronic Technologies Corporation (Japan)

  • Tetsuo Harada, University of Hyogo (Japan)

  • Koji Hosono, United Semiconductor Japan Co., Ltd. (Japan)

  • Daisuke Kenmochi, HOYA Corporation (Japan)

  • Yosuke Kojima, Toppan Photomask Co., Ltd. (Japan)

  • Toshio Konishi, Toppan Photomask Co., Ltd. (Japan)

  • Masaaki Koyama, Sony Semiconductor Manufacturing Corporation (Japan)

  • Yasutaka Morikawa, Dai Nippon Printing Co., Ltd. (Japan)

  • Hiroshi Nakata, Dai Nippon Printing Co., Ltd. (Japan)

  • Yasuko Saito, ASML Japan Co., Ltd. (Japan)

  • Kiwamu Takehisa, Lasertec Corporation (Japan)

  • James Wiley, Wiley Strategic Solutions (United States)

Session Chairs

  • 1 Opening Session: Day1

    Yosuke Kojima, Toppan Photomask Co., Ltd. (Japan)

  • 2 EUV Inspection & Repair

    Tetsuo Harada, University of Hyogo (Japan)

  • 3 NIL1

    Koji Ichimura, Dai Nippon Printing Co., Ltd. (Japan)

  • 4 NIL2

    Masami Yonekawa, Canon Inc. (Japan)

  • 5 EUV Lithography & Source

    Tsutomu Shoki, HOYA Corporation (Japan)

  • 6 Opening Session: Day2

    Hiroshi Nakata, Dai Nippon Printing Co., Ltd. (Japan)

  • 7 Mask Data Handling

    Kokoro Kato, Synopsys, Inc. (Japan)

  • 8 Poster Session

    Yosuke Kojima, Toppan Photomask Co., Ltd. (Japan)

  • 9 EUV Technologies

    Kazunori Seki, Toppan Photomask Co., Ltd. (Japan)

  • 10 Opening Session: Day3

    Akihiko Ando, Kioxia Corporation (Japan)

  • 11 Patterning Technologies

    Yusuke Kawano, Renesas Electronics Corporation (Japan)

  • 12 AI Utilization

    Kenji Go, Mycronic Technologies Corporation (Japan)

  • 13 Writing Tools

    Noriaki Nakayamada, NuFlare Technology, Inc. (Japan)

© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 12915", Proc. SPIE 12915, Photomask Japan 2023: XXIX Symposium on Photomask and Next-Generation Lithography Mask Technology, 1291501 (29 September 2023); https://doi.org/10.1117/12.3012450
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KEYWORDS
Photomasks

Printing

Extreme ultraviolet lithography

Nanoimprint lithography

Data modeling

Electron beam lithography

Image processing software

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