Paper
2 November 2023 Study on surface thermal deformation of laser cladding screw based on path planning
Changchang Yang, Jiale Wang, Junming Wang, Qian Zhan, Yilong Ye
Author Affiliations +
Proceedings Volume 12919, International Conference on Electronic Materials and Information Engineering (EMIE 2023); 129190L (2023) https://doi.org/10.1117/12.3010625
Event: 3rd International Conference on Electronic Materials and Information Engineering (EMIE 2023), 2023, Guangzhou,, China
Abstract
In order to solve the problem of deformation and cracking in laser additive manufacturing of the screw surface of complex structural parts, the residual stress and deformation of the screw surface during the cladding process of the deposition path were studied. The thermal stress simulation model of laser additive manufacturing was established to analyze the influence of different deposition paths on the surface stress and deformation of screw. It is found that the residual stress and deformation of screw surface are different under different deposition paths. The deformation is mainly concentrated in the two ends of the surface of the cladding screw, and different deposition paths have a great influence on the thermal stress deformation evolution behavior of the surface of the screw.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Changchang Yang, Jiale Wang, Junming Wang, Qian Zhan, and Yilong Ye "Study on surface thermal deformation of laser cladding screw based on path planning", Proc. SPIE 12919, International Conference on Electronic Materials and Information Engineering (EMIE 2023), 129190L (2 November 2023); https://doi.org/10.1117/12.3010625
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KEYWORDS
Beam path

Cladding

Deformation

Laser soldering

Thermal deformation

Additive manufacturing

Laser manufacturing

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