Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor

Kai Gao; Lei Yi; Shaojing Wang; Chuang Bi; Peng Xu; Feng Xue

doi:10.1117/12.3015615

16 January 2024 Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor

Kai Gao, Lei Yi, Shaojing Wang, Chuang Bi, Peng Xu, Feng Xue

Proceedings Volume 12973, Workshop on Electronics Communication Engineering (WECE 2023); 1297305 (2024) https://doi.org/10.1117/12.3015615
Event: Workshop on Electronics Communication Engineering (WECE 2023), 2023, Guilin, China

Abstract

In this paper, the bonding wire used for multi-chip interconnection is studied, and the model of non-parallel double bonding wires is proposed based on the single bonding wire model. Then, a microstrip impedance matching structure is designed based on the equivalent circuit model of non-parallel double bonding wires. In order to verify the effectiveness of microstrip impedance matching structure, experimental measurements are carried out. The experimental results show that the return loss is better than – 15dB in the frequency band of 25.8GHz - 40GHz, which is optimized by more than 5dB. The insertion loss is optimized by 0.7dB at most in the frequency band of 1GHz - 40GHz.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Kai Gao, Lei Yi, Shaojing Wang, Chuang Bi, Peng Xu, and Feng Xue "Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor", Proc. SPIE 12973, Workshop on Electronics Communication Engineering (WECE 2023), 1297305 (16 January 2024); https://doi.org/10.1117/12.3015615

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