CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 13159 > Article
Paper
13 May 2024 Stress analysis and temperature rise calculation of dry bushing spring contact finger structure under electric-thermal-force multi-field coupling
Zihong Yan, Lianhuan Xu, Xi Yang, Guangdong Hou
Author Affiliations +
Proceedings Volume 13159, Eighth International Conference on Energy System, Electricity, and Power (ESEP 2023); 131594A (2024) https://doi.org/10.1117/12.3024430
Event: Eighth International Conference on Energy System, Electricity and Power (ESEP 2023), 2023, Wuhan, China
Abstract
Spring contacts, as the electrically connected parts of dry bushing, are susceptible to thermal failure, which can seriously affect the reliability of equipment operation. In order to study the overheating failure mechanism of the spring contact, the spring contact for the electrical connection of 110kV dry bushing is selected as the research object, and a three-dimensional electric-thermal-force multi-physical field coupling simulation model of the spring contact is constructed. Firstly, based on the classical contact stress theory, the stress distribution under different compression is analyzed, and then, the equivalent force is calculated for the case of the minimum effective force. On the basis of this, the contact resistance value of the spring contact finger at each point is calculated for the case of minimum effective force, and then the temperature rise distribution of the spring contact finger under rated working conditions is studied. Finally, the model is verified by the true type test, and the simulation results coincide with the general characteristics of thermal failure of the bushing spring contact finger. The paper has important guiding significance for the thermal fault investigation and analysis of spring contact fingers of dry bushing contacts, and its structure optimization design.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Zihong Yan, Lianhuan Xu, Xi Yang, and Guangdong Hou "Stress analysis and temperature rise calculation of dry bushing spring contact finger structure under electric-thermal-force multi-field coupling", Proc. SPIE 13159, Eighth International Conference on Energy System, Electricity, and Power (ESEP 2023), 131594A (13 May 2024); https://doi.org/10.1117/12.3024430
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 7 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Resistance
Temperature distribution
Computer simulations
Electrical conductivity
Stress analysis
Thermal modeling
Boundary conditions
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top