Paper
12 November 1993 Cryogenic cooled silicon-based x-ray optical elements: heat load limit
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Abstract
A silicon block (typical size 100 X 100 X (20 - 50) mm3) cooled by liquid nitrogen has been studied with various incident power densities and spot sizes on the surface. Gaussian power distribution was assumed. Both bottom cooling and side cooling have been considered. The thermal slope error has been minimized by optimizing the cooling conditions (cooling coefficient and bulk temperature of liquid nitrogen) and the thickness of the silicon block. Finite element analysis has been used because the material properties ((alpha) , k) of silicon are highly non linear. The limits of absorbed total power and power density are estimated for both undulator and wiggler beams with various spot sizes and for the requirement in terms of thermal slope error. Correlations between thermal slope error and power, power density have been established.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lin Zhang "Cryogenic cooled silicon-based x-ray optical elements: heat load limit", Proc. SPIE 1997, High Heat Flux Engineering II, (12 November 1993); https://doi.org/10.1117/12.163803
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Cited by 9 scholarly publications.
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KEYWORDS
Silicon

Optical components

Liquids

Nitrogen

Cryogenics

Indium

Copper

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