Laser processing of palladium for selective electroless copper plating

Marie-Helene Bernier; Ricardo Izquierdo; Michel Meunier

doi:10.1117/12.167577

1 February 1994 Laser processing of palladium for selective electroless copper plating

Marie-Helene Bernier, Ricardo Izquierdo, Michel Meunier

Proceedings Volume 2045, Laser-Assisted Fabrication of Thin Films and Microstructures; (1994) https://doi.org/10.1117/12.167577
Event: Optics Quebec, 1993, Quebec City, Canada

Abstract

Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar⁺ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si₃N₄ leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.

Citation Download Citation

Marie-Helene Bernier, Ricardo Izquierdo, and Michel Meunier "Laser processing of palladium for selective electroless copper plating", Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); https://doi.org/10.1117/12.167577

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