X-ray microlithography exposure system for high aspect ratio micromachining

Yuli Vladimirsky; Kevin J. Morris; J. Michael Klopf; Olga Vladimirsky; Volker Saile

doi:10.1117/12.222654

26 September 1995 X-ray microlithography exposure system for high aspect ratio micromachining

Yuli Vladimirsky, Kevin J. Morris, J. Michael Klopf, Olga Vladimirsky, Volker Saile

Proceedings Volume 2640, Microlithography and Metrology in Micromachining; (1995) https://doi.org/10.1117/12.222654
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

A new x-ray micro-lithography exposure system has been designed and built at CAMD to meet specific demands of synchrotron radiation assisted high aspect ratio micromachining. The system consists of a broad-band transmission (1.2 angstroms to 6.5 angstroms) beamline and a multi-chamber X-ray Exposure Station. The beam line accepts radiation emitted in a bending magnet of the CAMD 1.3 - 1.5 GeV synchrotron storage ring. The beam line is approximately 10 m long and terminates with 125 micrometers thick Be window which defines an X-ray beam of 50 X 10 mm² at the exposure plane. The beam line is configured to provide 1.0 W/cm² at 1.5 GeV and 100 mA storage ring operation. The Exposure Station is designed to control different exposure conditions and can handle a variety of mask/sample assemblies. The first camber of the exposure tool is designated as a radiation filter, it controls x-ray spectra using foils and inert gases, and optimizes dose delivered to a sample with a thick resist (in excess of 1 mm). The second chamber is equipped with a multi-axes scanning mechanism to provide designed orientation and exposure of the mask/sample assembly. The two chamber can be separated by a thin foil to facilitate the use of reactive atmospheres for radiation induced chemical processes during exposure. An expansion of the Exposure Station providing large area exposures (up to 300 X 300 mm²) is described.

Citation Download Citation

Yuli Vladimirsky, Kevin J. Morris, J. Michael Klopf, Olga Vladimirsky, and Volker Saile "X-ray microlithography exposure system for high aspect ratio micromachining", Proc. SPIE 2640, Microlithography and Metrology in Micromachining, (26 September 1995); https://doi.org/10.1117/12.222654

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