Determination of critical process steps for enhanced yield improvement

J. B. Duluc; Thomas Zimmer; N. Lewis; Jean Paul Dom

doi:10.1117/12.250852

12 September 1996 Determination of critical process steps for enhanced yield improvement

J. B. Duluc, Thomas Zimmer, N. Lewis, Jean Paul Dom

Proceedings Volume 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II; (1996) https://doi.org/10.1117/12.250852
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

This paper presents a new method to isolate process steps causing performance spread of analogue or digital circuits. It is based on the analysis of process control or device parameters, sampled over one or more wafers of one or more lots. The analysis includes a physical approach of the parameters combined with a correlation coefficient study. This methodology which links parameters to process quantities, results in short-loop processing as well as in enhanced yield improvement.

Citation Download Citation

J. B. Duluc, Thomas Zimmer, N. Lewis, and Jean Paul Dom "Determination of critical process steps for enhanced yield improvement", Proc. SPIE 2874, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II, (12 September 1996); https://doi.org/10.1117/12.250852

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