Automated visual inspection stations for next-generation semiconductor package quality control

Mark R. DeYong; Thomas C. Eskridge; John W. Grace; Jeff E. Newberry; J. H. Jones; B. E. Hart

doi:10.1117/12.250923

13 September 1996 Automated visual inspection stations for next-generation semiconductor package quality control

Mark R. DeYong, Thomas C. Eskridge, John W. Grace, Jeff E. Newberry, J. H. Jones, B. E. Hart

Proceedings Volume 2877, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing III; (1996) https://doi.org/10.1117/12.250923
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

In the last several years, the semiconductor industry has come to the realization that the package into which a die is placed is at least as critical to the performance of the complete electronic system as the die itself. This realization has led to an explosive effort across the entire industry to advance the state-of-the-art in semiconductor packaging. To date, this effort has already produced semiconductor packaging options on the scale of the die (i.e., chip scale packaging -- CSP). While CSPs and other advanced packaging techniques provide improved electronic system performance, they also increase the quality control burden (despite the highly automated processes used to manufacture the packages, quality control remains, for the most part, a manual operation). This paper addresses the necessary requirements of automated visual inspection (AVI) for quality control of current and future semiconductor packaging. The necessary requirements of the station are subdivided into two categories: those pertaining to the hardware platform, and those pertaining to the software reasoning engine. Hardware requirements are discussed in terms of finding the best match between commercial, off-the- shelf, hardware components and a given inspection application. Components reviewed include: imagers, optics, illumination systems, auto-focus/alignment systems, material handlers, parallel image preprocessors, and host computers. Applications reviewed include: pin grid array (PGA), ball grid array (BGA), and flip-chip package inspection. Also discussed in the hardware section are options that may be used when commercial components are not adequate. Software requirements are discussed in terms of the functionality required to provide accurate, real-time characterization of package quality, to gain operator acceptance, and to produce meaningful statistics for use in process control.

Citation Download Citation

Mark R. DeYong, Thomas C. Eskridge, John W. Grace, Jeff E. Newberry, J. H. Jones, and B. E. Hart "Automated visual inspection stations for next-generation semiconductor package quality control", Proc. SPIE 2877, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing III, (13 September 1996); https://doi.org/10.1117/12.250923

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