Wafer bonding technique for fabricating 1.5-um InGaAs/InGaAsP pillar-free microdisk lasers

Sheng Li Wu; Lijun Wang; Jianping Zhang; Liwei Wang; Seng Tiong Ho

doi:10.1117/12.251909

24 September 1996 Wafer bonding technique for fabricating 1.5-μm InGaAs/InGaAsP pillar-free microdisk lasers

Sheng Li Wu, Lijun Wang, Jianping Zhang, Liwei Wang, Seng Tiong Ho

Proceedings Volume 2886, Semiconductor Lasers II; (1996) https://doi.org/10.1117/12.251909
Event: Photonics China '96, 1996, Beijing, China

Abstract

A new wafer bonding-etching technique has been developed successfully for micro-disk laser fabrication. Pillar-free micro-disk lasers have been realized. The micro-disk is placed on low refractive index material such as SiO₂ and surrounded by SiO₂ and air. The pillar-free micro-disk laser shows more solid than the pillar-supported micro-disk lasers. It has similar threshold pump power compared with the pillar-supported micro-disk lasers.

Citation Download Citation

Sheng Li Wu, Lijun Wang, Jianping Zhang, Liwei Wang, and Seng Tiong Ho "Wafer bonding technique for fabricating 1.5-μm InGaAs/InGaAsP pillar-free microdisk lasers", Proc. SPIE 2886, Semiconductor Lasers II, (24 September 1996); https://doi.org/10.1117/12.251909

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available